below marketmost similar roles pay hereabove market
This role pays less than
85%
of similar roles. Most pay
$114,862–$214,000
— the blue band above.
At the midpoint, this role pays about
$100k
versus about
$164k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
496 open roles
on FindRole.
Listed pay typically runs
$172,000–$258,000
across 496 roles with salary data.
The 2027 Masters ASIC Package Engineering Co-op/Intern will join the engineering team to help bring advanced packaging technology to reality. In this role, the student will support Package design and Package Development Engineers by prioritizing and optimizing new projects. Day-to-day responsibilities include completing substrate, interposer, and bump designs for products, test vehicles, and probe card substrates. The intern will also perform design verification implementation to ensure performance, quality, and efficiency while analyzing yield and defect metrics. Key tasks involve evaluating and benchmarking packaging materials to achieve cost-efficient designs. Required skills and knowledge include transmission lines, electric circuits, semiconductor theory, and packaging processes. Candidates should possess experience with package, silicon, or PCB design software, scripting languages like Perl, Python, or SQL, and data visualization tools like powerBI.
Support Package design and Development Engineers in prioritizing and optimizing new projects.
Complete substrate, interposer, and bump designs for AMD products and test vehicles.
Implement design verification projects to ensure product performance, quality, and efficiency.
Analyze yield and defect metrics to improve overall design performance.
Evaluate and benchmark packaging materials to achieve cost-efficient designs.
Interact with partners to meet specific performance and yield requirements.
What we're looking for
You must be currently enrolled in a US-based University in a Master's degree program.
Your major must be Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
You must be able to work full-time (40 hours a week) in a hybrid or onsite structure.
Knowledge of transmission lines and electric circuits is preferred.
Experience with package, silicon, or PCB design software is preferred.
Proficiency in scripting languages such as Perl, Python, or SQL is preferred.
Knowledge of semiconductor theory and packaging process/technology is preferred.
Experience with data analytics and visualization tools like PowerBI is preferred.
C++
Linux
Perl
Ruby
Shell Script
Java
GIT
SVN
CVS
RCS
XP
Agile
Scrum
Kanban
Logic Analyzers
Oscilloscopes
Computer Architecture
Digital Logic
Circuit Theory