Server Finite Element Analysis (FEA) Engineer

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$180,500–$270,700 / yr
Posted
23 days ago
Freshness
Confirmed live yesterday
Closes
Feb 15, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $181k
This role $226k
$127k most similar roles pay here $286k

This role pays more than 82% of similar roles. Most pay $152,325–$208,900 — the shaded band above. At the midpoint, this role pays about $226k versus about $181k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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At a glance

TL;DR · Server Finite Element Analysis (FEA) Engineer

The Server Finite Element Analysis (FEA) Engineer joins the Data Center team to serve as a technical authority for structural simulation and system-level modeling of high-performance server platforms. This individual contributor leads multi-scale structural physics across package, board, chassis assembly, and full rack-level architectures. Day-to-day responsibilities include performing structural dynamics modeling—including modal, shock, drop, and random vibration—while correlating analytical models with physical test data to ensure mechanical robustness and manufacturability. The role requires expertise in structural mechanics, materials science, and multi-physics coupling. Candidates must be proficient in tools such as ANSYS, ABAQUS, or HyperMesh. This position addresses the technical challenge of ensuring lifecycle reliability for server systems by providing simulation-informed design guidance across various hardware components, from microelectronics packaging to integrated rack-scale infrastructure within high-performance computing environments.

What you'll do

  • Lead multi-scale FEA simulations across package, board, chassis assembly, system, and rack levels.
  • Perform structural dynamics modeling including modal, shock, drop, random vibration, and harmonic response.
  • Drive platform-level structural architecture decisions based on simulation results.
  • Correlate analytical models with physical test data from component, system, and rack levels.
  • Define and maintain platform simulation methodologies, modeling standards, and validation frameworks.
  • Translate complex simulation data into actionable design guidance for cross-functional engineering teams.
  • Present technical analyses to engineering leadership, customers, and suppliers.

What we're looking for

  • Master's degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a related field.
  • Bachelor's degree and 6+ years of experience, or a PhD and 4+ years of experience in relevant engineering fields.
  • 6+ years of advanced FEA experience in high-tech hardware platforms including microelectronics packaging and server chassis assemblies.
  • Proficiency in ANSYS, ABAQUS, HyperMesh, or equivalent simulation software.
  • Strong background in structural mechanics, materials science, and structural dynamics.
  • Experience correlating system-level FEA with physical testing such as modal, shock, vibration, and environmental tests.
  • Ability to lead multi-scale structural simulations across package, board, chassis, and rack-level architectures.
  • Strong technical documentation and communication skills for cross-functional team collaboration.

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