This role pays less than
82%
of similar roles. Most pay
$150,000–$213,375
— the shaded band above.
At the midpoint, this role pays about
$140k
versus about
$182k
for comparable roles.
Based on 240 similar postings.
Employer
About Broadcom
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has
119 open roles
on FindRole.
Listed pay typically runs
$121,900–$195,000
across 105 roles with salary data.
The IC Package Mechanical FEA Engineer (R&D) joins a worldwide R&D team to develop high-performance package designs for ASICs used in artificial intelligence, networking, high-performance computing, and 5G base stations. This role involves designing mechanical aspects of ASIC packages while using advanced finite element analysis to quantify and optimize reliability and manufacturing. You will manage multiple projects simultaneously, collaborating with internal and external partners to balance trade-offs between warpage, stress, reliability, cost, thermal, and electrical performance. The work involves emerging technologies like co-packaged fiber-optic transceivers, complex chip stacking including 3DIC and hybrid copper bonding, and multi-chip-module designs. Key requirements include expertise in FEA modeling, mechanical testing, and measurement to validate results against first principles. Preferred tools include Ansys Classic or Mechanical, alongside strong technical documentation and presentation skills for diverse audiences.