IC Package Mechanical FEA Engineer (R&D)

Broadcom

Quick summary

Work type
On-site
Location
Fort Collins, CO · San Jose, CA
Salary
$108,000–$172,800 / yr
Posted
4 days ago
Closes
Nov 26, 2026

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $166k
This role $140k
$98k most similar roles pay here $204k

This role pays less than 73% of similar roles. Most pay $139,000–$192,500 — the shaded band above. At the midpoint, this role pays about $140k versus about $166k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 105 open roles on FindRole.

Listed pay typically runs $120,000–$192,000 across 103 roles with salary data.

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View all roles at Broadcom

At a glance

TL;DR · IC Package Mechanical FEA Engineer (R&D)

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Broadcom seeks a senior package mechanical FEA engineer to join its global R&D team, focusing on designing high-performance packages for advanced ASICs used in AI, networking, HPC, and 5G. The role involves using advanced FEA techniques to optimize reliability and manufacturing processes while collaborating with internal and external partners to ensure design integrity across multiple projects. Key responsibilities include developing unique MCM and FCBGA packages, conducting mechanical testing, and creating detailed documentation and presentations for various stakeholders. Ideal candidates have a strong background in Mechanical Engineering and extensive experience with Ansys or similar tools, along with the ability to manage complex simulations and validate results through empirical data.

Skills

Ansys FEA Mechanical Engineering Strength of Materials Python MATLAB LabVIEW SolidWorks CAD CAE Simulation Testing Validation Documentation Presentation Skills Co-design Multi-project Management Time Zone Collaboration

What you'll do

  • Design mechanical aspects of ASIC packages using advanced FEA.
  • Quantify and optimize reliability and manufacturing processes through simulations.
  • Validate models by measuring and experimenting to ensure accuracy.
  • Develop and document design rules and guidelines for package designs.
  • Collaborate with R&D teams to influence mechanical design decisions.
  • Present findings and technical data to various stakeholders, including senior management.

What we're looking for

  • Bachelor’s degree in Mechanical Engineering or related field with 8+ years of FEA modeling experience.
  • Evaluate complex numerical simulation results using strength of materials principles.
  • Calibrate models and results with empirical data from existing studies.
  • Perform mechanical testing, devise lab-scale tests for validation.
  • Experience with Ansys Classic/Mechanical or equivalent software preferred.
  • Strong self-management skills and ability to present technical information effectively.

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