Senior System and Manufacturing CoDesign Architect, Power, Thermal and Packaging

Nvidia

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Santa Clara, CAHillsboro, OR
Salary
$196,000–$310,500 / yr
Employment
Full-time
Posted
34 days ago
Freshness
Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $205k
This role $253k
$148k $328k
below market most similar roles pay here above market

This role pays more than 83% of similar roles. Most pay $173,781–$235,750 — the blue band above. At the midpoint, this role pays about $253k versus about $205k for comparable roles.

Based on 240 similar postings.

Employer

About Nvidia

Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing

Nvidia currently has 1623 open roles on FindRole.

Listed pay typically runs $184,000–$287,500 across 1110 roles with salary data.

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At a glance

TL;DR · Senior System and Manufacturing CoDesign Architect, Power, Thermal and Packaging

The Senior System and Manufacturing CoDesign Architect joins the Silicon Co-Design Group to address the widening gap between system architecture needs and manufacturable capabilities as GPU power density and thermal limits approach physical boundaries. This role involves identifying where physical constraints erode competitive edges and building cross-domain responses to leapfrog those limits. Key responsibilities include analyzing hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, developing solutions spanning silicon features, packaging innovation, firmware, and hardware co-design, and evaluating emerging packaging technologies for voltage, frequency, noise, reliability, and testability. The position requires deep expertise in power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems, utilizing first principles thinking to solve complex electrical, thermal, mechanical, and manufacturing problems simultaneously.

What you'll do

  • Analyze packaging, power delivery, and thermal dissipation constraints against roadmap demands.
  • Predict when physical constraints will reduce product competitiveness and develop proactive solutions.
  • Develop cross-domain solutions spanning silicon features, packaging innovation, firmware, and hardware co-design.
  • Evaluate emerging packaging technologies for voltage, frequency, noise, reliability, and testability implications.
  • Drive improvements in performance-per-watt and provisioning efficiency through system-manufacturing co-design.
  • Convert physical-limit trends into measurable impacts and actionable engineering solutions.
  • Ensure future products meet high-quality reliability and DFX standards through integrated hardware updates.

What we're looking for

  • BS/MS/PhD in EE, Physics, or CE (or equivalent experience).
  • 12+ years of relevant experience.
  • Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems.
  • Proven ability to convert physical-limit trends into impact, measures, and solutions.
  • Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations.
  • Native use of AI to accelerate build exploration and problem-space modeling (preferred).
  • Experience solving problems spanning electrical, thermal, mechanical, and manufacturing domains simultaneously (preferred).

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