Integrated Circuit Packaging Architect Engineer
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How this pay compares to similar roles
This role pays more than 83% of similar roles. Most pay $173,781–$235,750 — the blue band above. At the midpoint, this role pays about $253k versus about $205k for comparable roles.
Based on 240 similar postings.
Employer
Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing
Nvidia currently has 1623 open roles on FindRole.
Listed pay typically runs $184,000–$287,500 across 1110 roles with salary data.
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At a glance
The Senior System and Manufacturing CoDesign Architect joins the Silicon Co-Design Group to address the widening gap between system architecture needs and manufacturable capabilities as GPU power density and thermal limits approach physical boundaries. This role involves identifying where physical constraints erode competitive edges and building cross-domain responses to leapfrog those limits. Key responsibilities include analyzing hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, developing solutions spanning silicon features, packaging innovation, firmware, and hardware co-design, and evaluating emerging packaging technologies for voltage, frequency, noise, reliability, and testability. The position requires deep expertise in power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems, utilizing first principles thinking to solve complex electrical, thermal, mechanical, and manufacturing problems simultaneously.
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