Senior TPM, Embedded Software
Amazon Inc
Quick summary
Market check
How this pay compares to similar roles
This role pays more than 50% of similar roles. Most pay $158,950–$213,375 — the blue band above. At the midpoint, this role pays about $177k versus about $186k for comparable roles.
Based on 240 similar postings.
Employer
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has 648 open roles on FindRole.
Listed pay typically runs $119,800–$234,700 across 624 roles with salary data.
Most-posted roles
At a glance
The Senior HW Engineer, TPM joins the Cloud Hardware Systems Engineering team to manage and optimize cloud infrastructure. This role involves leading end-to-end lab support for major sites, coordinating global lab alignment, and owning roadmap-to-capacity planning for space, power, cooling, networks, and racks. The engineer will drive AI and compute rack readiness, including integration, power distribution, cabling, optics, and burn-in scheduling. Key responsibilities include managing long-lead procurement for compute and network equipment, establishing repeatable operating models, and overseeing site expansions and platform transitions. Required skills include technical engineering experience, proficiency with Jira or Azure DevOps, and knowledge of network equipment and compute hardware. The role solves critical infrastructure challenges by improving manufacturing planning, quality, delivery, and sustainability for large-scale cloud hardware systems.
Skills
What you'll do
What we're looking for
Related searches
More like this
Amazon Inc
Cisco
Cisco
Anduril Industries
Amazon Inc
Amazon Inc