Senior HSIO Bench Test Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 68% of similar roles. Most pay $169,250–$216,250 — the shaded band above. At the midpoint, this role pays about $172k versus about $193k for comparable roles.
Based on 240 similar postings.
Employer
Samsung Semiconductor is the global semiconductor business unit of Samsung Electronics, designing and manufacturing memory chips, logic semiconductors, and foundry solutions for a broad range of applications.
Samsung Semiconductor currently has 49 open roles on FindRole.
Listed pay typically runs $163,000–$253,000 across 49 roles with salary data.
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At a glance
The Senior HSIO Digital Design Engineer joins the Location Group to develop next-generation high-speed I/O designs for AI production platforms. This role involves developing High-Speed I/O PHY IP, focusing on die-to-die chiplet interfaces and similar technologies. The engineer will manage the end-to-end digital design flow while collaborating with system and analog teams to navigate trade-offs between high-speed serial interconnect protocols and mixed-signal design impacts. Key technical requirements include expertise in Signal Integrity and Power Integrity modeling for High-Speed I/O designs, as well as familiarity with HSIO PHY layers, architectures, and SoC protocols such as AXI, CHI, CXS.B, CXL, PCIe, and UA-Link. The position addresses the critical challenge of creating highly integrated products by optimizing high-speed communication within complex systems to support advanced mobile, wearable, and infrastructure applications.
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