Quick summary
- Work type
- On-site
- Location
- —
- Salary
- $120,000–$192,000 / yr
- Employment
- Full-time
- Posted
- 153 days ago
- Freshness
- Confirmed live yesterday
- Closes
- Oct 31, 2026
Market check
Salary context
How this pay compares to similar roles
This role pays less than 79% of similar roles. Most pay $159,700–$237,200 — the shaded band above. At the midpoint, this role pays about $156k versus about $198k for comparable roles.
Based on 240 similar postings.
Employer
About Broadcom
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has 223 open roles on FindRole.
Listed pay typically runs $121,900–$195,000 across 160 roles with salary data.
Most-posted roles
- Forward Deployed Engineer 9
- Physical Design Engineer 9
- Software Engineer 9
- R&D Engineer IC Design 7
- R&D Engineer Software 7
At a glance
TL;DR · R&D Engineer IC Design
As an R&D Engineer IC Design within the core switching group, you will design cutting-edge CoWoS 2.5D and 3D interposer designs for high-speed network switches. Your daily responsibilities include designing interposers with custom routing for high-speed interfaces, bump map design, physical verification, and tapeout to foundries while collaborating with packaging, signal integrity, and foundry teams. You will utilize EDA tools such as Cadence Innovus, Integrity, Synopsys 3DIC compiler, and Mentor Graphics Calibre. The role requires expertise in TSV design, micro-bumps, solder bumps, and interconnect technologies, alongside scripting skills in Python, Tcl, and SKILL for automation. You must understand the impact of routing on signal integrity, power integrity, and thermal analysis while navigating semiconductor fabrication processes to solve complex packaging challenges for enterprise and mega scale data center infrastructure.
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