R&D Engineer IC Design

Broadcom

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
—
Salary
$120,000–$192,000 / yr
Employment
Full-time
Posted
153 days ago
Freshness
Confirmed live yesterday
Closes
Oct 31, 2026

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $198k
This role $156k
$105k most similar roles pay here $260k

This role pays less than 79% of similar roles. Most pay $159,700–$237,200 — the shaded band above. At the midpoint, this role pays about $156k versus about $198k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 223 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 160 roles with salary data.

Most-posted roles

View all roles at Broadcom

At a glance

TL;DR · R&D Engineer IC Design

As an R&D Engineer IC Design within the core switching group, you will design cutting-edge CoWoS 2.5D and 3D interposer designs for high-speed network switches. Your daily responsibilities include designing interposers with custom routing for high-speed interfaces, bump map design, physical verification, and tapeout to foundries while collaborating with packaging, signal integrity, and foundry teams. You will utilize EDA tools such as Cadence Innovus, Integrity, Synopsys 3DIC compiler, and Mentor Graphics Calibre. The role requires expertise in TSV design, micro-bumps, solder bumps, and interconnect technologies, alongside scripting skills in Python, Tcl, and SKILL for automation. You must understand the impact of routing on signal integrity, power integrity, and thermal analysis while navigating semiconductor fabrication processes to solve complex packaging challenges for enterprise and mega scale data center infrastructure.

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