Process Engineer - Die to Wafer Hybrid Bonding

What you'll do

• Develop die to wafer hybrid bonding processes including surface preparation and plasma activation.
• Perform high accuracy die placement and alignment during the manufacturing process.
• Conduct post-bond characterization and evaluate overall process performance.
• Integrate D2W bonding with adjacent modules like dicing, thinning, and planarization.
• Design and execute DOE-driven experiments to identify process limits and sensitivities.
• Perform failure analysis and characterize materials to drive continuous engineering improvements.
• Collect and analyze data to troubleshoot complex hardware and manufacturing issues.
• Generate technical documentation and engage with customers to resolve technical concerns.

What we're looking for

• Ph.D. or M.S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• In-depth knowledge and hands-on experience in die to wafer or wafer to wafer hybrid bonding.
• Experience with thin die handling, alignment critical processes, or heterogeneous integration (preferred).
• Experience with Micro-LED, CPO, or 2.5D/3D integration (preferred).
• Direct process engineer experience on mainstream semiconductor equipment such as plasma, wet clean, and overlay/alignment.
• Strong understanding of bond interface physics, alignment and overlay fundamentals, and mechanical behavior of thin dies.
• Proficiency in statistical analysis and process control using tools like DOE, SPC, and JMP.
• Strong communication skills and the ability to work both independently and collaboratively across multidisciplinary teams.