Process Engineering Intern

Lam Research

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Tualatin, OR
Employment
Intern
Posted
60 days ago
Freshness
Confirmed live yesterday
Closes
Jan 9, 2027

Market check

Salary context

How this pay compares to similar roles

Similar $139k
$96k most similar roles pay here $183k

This listing doesn't post a salary. Most similar roles pay $104,000–$174,750.

Based on 240 similar postings.

Employer

About Lam Research

Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.

Lam Research currently has 299 open roles on FindRole.

Listed pay typically runs $114,000–$253,000 across 141 roles with salary data.

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At a glance

TL;DR · Process Engineering Intern

As a Process Engineering Intern within the WETS group, you will join the Sabre 3D process development and engineering team to advance wafer fab equipment electrodeposition technology for advanced packaging applications like silicon via, through glass via, panel level plating, and grain engineering. You will perform research and development activities including running bench scale experiments, operating deposition tools, conducting chemistry and material analysis, and utilizing metrology tools to characterize wafer performance. Your work involves testing new process formulations and compiling data from scientific journal research. The role requires skills in modeling and simulation of transport phenomena or electrochemical kinetics, along with a deep understanding of grain growth mechanisms and microstructure evolution. You will apply knowledge of electrochemistry involving copper, tin, and nickel deposition while troubleshooting complex systems to improve equipment and reactor performance.

What you'll do

  • Apply engineering and electrodeposition methodologies to develop features for the SABRE 3D system.
  • Test and characterize new or modified process formulations for product development and technology support.
  • Set up and run bench-scale experiments in a laboratory environment.
  • Operate application lab deposition tools and perform chemistry and material analysis.
  • Use metrology tools to measure and characterize wafer deposition performance.
  • Compile and organize data and conduct scientific journal research for R&D activities.
  • Troubleshoot complex equipment and systems during the development process.
  • Utilize modeling and simulation techniques to support process understanding and optimization.

What we're looking for

  • Pursuing a Master's or PhD degree in Chemical Engineering, Chemistry, Mechanical Engineering, or Material Science.
  • Experience with modeling and simulation techniques such as transport phenomena, electrochemical kinetics, or microstructural evolution.
  • Hands-on experience working in a wet laboratory environment.
  • Experience troubleshooting complex equipment and systems.
  • Knowledge of electrochemistry, specifically regarding copper, tin, tin-alloys, and nickel electrodeposition.
  • Solid understanding of grain growth mechanisms and microstructure evolution.
  • Practical, hands-on experience in electroplating process development, including bath chemistry, additives, and defect characterization.
  • Strong analytical and problem-solving skills to bridge theoretical understanding with practical process development.

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