Process Engineer, Plasma Etch
Applied Materials
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How this pay compares to similar roles
This role pays more than 51% of similar roles. Most pay $135,000–$177,450 — the blue band above. At the midpoint, this role pays about $148k versus about $156k for comparable roles.
Based on 240 similar postings.
Employer
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has 365 open roles on FindRole.
Listed pay typically runs $126,000–$173,500 across 222 roles with salary data.
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At a glance
As a Process Engineer III – (E3), you will join a process development team focused on next-generation thin-film deposition and surface treatment for advanced logic interconnect. You will own process development on 300 mm chambers, working closely with hardware engineering teams to transition new technology from feasibility to qualified process. Your daily responsibilities include owning experiments end to end, designing DOEs, performing wafer runs, and conducting metrology and analysis. You will develop and optimize deposition and plasma-based processes to meet specific film performance, integration, and reliability targets. Key skills include hardware characterization, data-driven root-cause analysis, and troubleshooting. You will utilize standard thin-film metrology and analytical techniques to connect process conditions to film properties while collaborating with mechanical, electrical, and RF engineering teams.
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