Process Engineer III

Applied Materials

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Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$124,000–$171,000 / yr
Employment
Full-time
Posted
4 days ago
Freshness
Confirmed live today

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $156k
This role $148k
$109k $188k
below market most similar roles pay here above market

This role pays more than 51% of similar roles. Most pay $135,000–$177,450 — the blue band above. At the midpoint, this role pays about $148k versus about $156k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 365 open roles on FindRole.

Listed pay typically runs $126,000–$173,500 across 222 roles with salary data.

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At a glance

TL;DR · Process Engineer III

As a Process Engineer III – (E3), you will join a process development team focused on next-generation thin-film deposition and surface treatment for advanced logic interconnect. You will own process development on 300 mm chambers, working closely with hardware engineering teams to transition new technology from feasibility to qualified process. Your daily responsibilities include owning experiments end to end, designing DOEs, performing wafer runs, and conducting metrology and analysis. You will develop and optimize deposition and plasma-based processes to meet specific film performance, integration, and reliability targets. Key skills include hardware characterization, data-driven root-cause analysis, and troubleshooting. You will utilize standard thin-film metrology and analytical techniques to connect process conditions to film properties while collaborating with mechanical, electrical, and RF engineering teams.

What you'll do

  • Own experiments end-to-end from DOE design and wafer runs through metrology and analysis.
  • Develop and optimize deposition and plasma-based processes to meet performance and reliability targets.
  • Characterize films using standard thin-film metrology and analytical techniques.
  • Partner with mechanical, electrical, and RF engineering teams on hardware requirements and design reviews.
  • Support new hardware bring-up, qualification, and chamber troubleshooting using data-driven root-cause analysis.
  • Plan and run multiple experiment tracks in parallel to maximize tool time efficiency.
  • Communicate technical results to cross-functional teams and management to drive independent work.

What we're looking for

  • PhD in Chemistry, Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related field with 0–3 years of industry experience.
  • MS in Chemistry, Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related field with 2–5 years of industry experience.
  • Demonstrate conceptual and practical expertise in complex problem solving.
  • Possess hands-on experience in semiconductor thin-film deposition or plasma processing.
  • Demonstrate strong written and verbal communication skills.

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