Process Engineer, Plasma Etch

Applied Materials

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Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$124,000–$171,000 / yr
Employment
Full-time
Posted
15 days ago
Freshness
Confirmed live today

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Salary context

Below market

How this pay compares to similar roles

Similar $191k
This role $148k
$112k $240k
below market most similar roles pay here above market

This role pays less than 78% of similar roles. Most pay $155,000–$227,900 — the blue band above. At the midpoint, this role pays about $148k versus about $191k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 337 open roles on FindRole.

Listed pay typically runs $124,000–$171,000 across 219 roles with salary data.

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At a glance

TL;DR · Process Engineer, Plasma Etch

Process Engineer – Plasma Etch As a Process Engineer, you will join the team to design and optimize manufacturing processes for display and semiconductor manufacturing technologies. You will develop and optimize advanced plasma etch processes, execute experiments, and analyze data using data-driven methodologies to drive process improvements. Your daily responsibilities include performing hardware characterization, investigating chamber-related issues through structured root cause analysis, and generating technical documentation. You will collaborate with R&D, manufacturing, and customers to resolve complex technical challenges and support next-generation technology development. The role requires expertise in plasma etch process development, DOE, and statistical analysis tools like JMP. You will utilize characterization techniques including TEM, SEM, and EDS while working with specific hardware such as Producer, DPS, Centris, Sym3, Sym3 Y, and Sym3 Z chambers.

What you'll do

  • Develop and optimize plasma etch processes for advanced semiconductor applications.
  • Design and execute experiments to drive process improvements using data-driven methodologies.
  • Investigate and resolve process and chamber-related issues through structured root cause analysis.
  • Characterize process-chamber interactions and evaluate hardware performance.
  • Support customer escalations and provide technical solutions to manufacturing challenges.
  • Prepare technical reports and comprehensive engineering documentation.
  • Collaborate with cross-functional teams to implement new technologies and continuous improvement initiatives.

What we're looking for

  • Bachelor's or Master's degree in Engineering, Materials Science, Physics, or a related technical field.
  • 4-7 years of relevant industry experience with a Bachelor's degree.
  • 2-5 years of relevant industry experience with a Master's degree.
  • Strong analytical, problem-solving, and communication skills.
  • Semiconductor fab experience in plasma etch process development and optimization (preferred).
  • Hands-on experience with Applied Materials etch systems (preferred).
  • Experience with chamber troubleshooting, process qualification, and customer-facing technical support (preferred).
  • Knowledge of DOE, statistical analysis tools (JMP or equivalent), TEM, SEM, and EDS characterization techniques (preferred).

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