This role pays less than
83%
of similar roles. Most pay
$162,750–$233,812
— the shaded band above.
At the midpoint, this role pays about
$148k
versus about
$198k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
260 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 192 roles with salary data.
Process Engineer – Die to Wafer Hybrid Bonding
Joining the Photonics Platforms Business Group, you will work with a cross-functional research team to develop 2.5D/3D advanced packaging technologies. This role focuses on die-to-wafer hybrid bonding R&D, including surface preparation, plasma activation, high-accuracy die placement, and post-bond characterization. You will design and execute DOE-driven experiments to understand process limits while performing failure analysis and process optimization. The work involves integrating bonding with modules like dicing, die thinning, and planarization. Key technical requirements include experience in wafer-to-wafer bonding, thin-die handling, and heterogeneous integration of materials like III-V to Si. You will utilize tools for statistical analysis and process control such as JMP. Candidates must possess expertise in bond interface physics, alignment fundamentals, and the mechanical behavior of fragile dies to solve complex challenges in advanced packaging integration.