Principal Chipset Project Engineer, Thermal/Limits for Personal Computer

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $211,900–$317,900 / yr
Posted: 161 days ago
Freshness: Confirmed live yesterday
Closes: Sep 30, 2026
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $199k

This role $265k

$140k most similar roles pay here $337k

This role pays more than 91% of similar roles. Most pay $170,000–$227,500 — the shaded band above. At the midpoint, this role pays about $265k versus about $199k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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At a glance

TL;DR · Principal Chipset Project Engineer, Thermal/Limits for Personal Computer

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The Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC) joins the Compute Chipset Project Engineering team to lead thermal and limits strategy across the compute product portfolio from concept through commercialization. This individual will define system thermal budgets, develop methodologies and tools to predict thermal behavior, model thermally constrained performance, and influence design choices to maximize performance within fixed constraints of cost and size. The role involves evaluating novel thermal solutions, overseeing the resolution of all thermal issues across chipsets, and providing customer guidance on targets and tuning. Key responsibilities include collaborating with internal engineering leads and external partners like OEMs and ODMs in a matrixed environment. Essential skills include expertise in semiconductor product development, thermal systems for PC products, and the ability to communicate complex technical information to executive leadership.

Skills

Thermal Management Firmware Product Development Performance Tuning

What you'll do

Guide design and architectural choices to maximize performance within thermal, cost, and size constraints.
Develop methodologies and tools to predict thermal behavior and assess performance impacts.
Evaluate new and novel thermal solutions for the compute product portfolio.
Assess how specific system component selections impact overall thermal performance.
Influence system limits management features and establish best practices for thermal tuning.
Oversee the resolution of all thermal-related issues across various chipsets.
Provide customers with guidance on thermal targets, debug support, and tuning solutions.

What we're looking for

Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or a related field with 8+ years of experience.
Master's degree in Electrical Engineering, Computer Science, Computer Engineering, or a related field with 7+ years of experience.
PhD in Electrical Engineering, Computer Science, Computer Engineering, or a related field with 6+ years of experience.
8+ years of experience in one or more areas of semiconductor product development.
5+ years of experience in a technical leadership role.
8+ years of experience in a thermal systems role, preferably for PC thermal systems.
4+ years of experience working in a large matrixed organization.
3+ years of experience in a role requiring interaction with executive leadership.

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