Principal Chipset Project Engineer, Hardware PCB/Platform Systems for Personal Compute (PC)
Qualcomm
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How this pay compares to similar roles
This role pays more than 93% of similar roles. Most pay $177,300–$242,212 — the blue band above. At the midpoint, this role pays about $279k versus about $210k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 575 open roles on FindRole.
Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.
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At a glance
The Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC) joins the Compute Chipset Project Engineering team to lead thermal and limits strategy across the compute product portfolio from concept to commercialization. This role involves defining system thermal budgets, developing methodologies and tools to predict thermal behavior, and modeling thermally constrained performance. The engineer will influence designs, plan features, tune system limits, and provide customer guidance on thermal targets. Key responsibilities include extracting maximum performance from systems with fixed product constraints and overseeing the resolution of all thermal issues. The position requires expertise in semiconductor product development, thermal systems, and system design. The role addresses the technical challenge of balancing high-performance compute capabilities with strict thermal, cost, and size constraints within personal computer hardware.
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