The Principal Chipset Project Engineer – Thermal/Limits for Personal Computer at Qualcomm Technologies, Inc., is a senior role within the Compute Chipset Project Engineering team, responsible for leading thermal and limits strategy across compute products from concept to commercialization. This position involves defining system thermal budgets, developing methodologies and tools to predict thermal behavior, modeling thermals, and influencing design features while working closely with engineering leads, product management, and OEMs. The ideal candidate has a Master's or Ph.D. in Electrical Engineering or related field, 10+ years of semiconductor product development experience, and extensive knowledge in PC thermal systems. They must excel in a matrixed environment, engaging with executive leadership to communicate thermal goals and status effectively, while driving the highest thermally constrained system performance within fixed constraints.
Skills
Thermal simulation
PC thermal systems
System design
Silicon design
SW development
Matrixed organization
Executive communication
Methodology development
Tool development
Performance tuning
Customer interaction
Negotiation skills
Influence management
Long-term planning
Complex information communication
What you'll do
Define system thermal budgets and methodologies to analyze and predict thermal behavior.
Model thermals and performance under thermal constraints for compute chipsets.
Influence design choices to maximize performance while meeting product constraints.
Evaluate new thermal solutions and assess the impact of component selection on thermals.
Oversee resolution of all thermal-related issues across chipsets in development.
Provide guidance to customers on thermal targets, debug, and tuning support.
What we're looking for
Master's Degree or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or related field.
10+ years of experience in semiconductor product development areas such as system design and silicon validation.
8+ years of experience in thermal systems engineering with preference for PC industry expertise.
4+ years of experience working in a large matrixed organization.
3+ years of work experience interacting with executive leadership.
Market check
Salary context
This
$211,900–$317,900
range sits above
94%
of similar postings on FindRole.
Peer median band
$154,000–$241,500
Median floor and ceiling across peers.
Typical midpoint (25–75%)
$164,600–$235,750
Middle half of comparable postings.
Based on 240 comparable postings.*
* 240 is the maximum number of comparable postings sampled.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
564 open roles
on FindRole.
Listed pay typically runs
$148,300–$224,400
across 531 roles with salary data.
Santa Clara, Ca,Us, US18 days ago
$198,700–$298,100
CPU
SoC
Datacenter Server
Mobile Compute
Auto SoCs
Boot Architecture
APCI
PSCI
Dynamic Voltage and Frequency Scaling
Analog Mixed Signals IPs
Over-Current Protection
Power Management
Thermal Management
Software Control Loops
Firmware Control Loops
High-Level Architecture Specification
RTL Design
ARM
C
C++
Python
Linux
SoC
debugging
multithreaded architecture
real-time operating systems
power management
performance management
thermal measurement
machine learning
system level software optimizations
communication skills
collaboration
technical documentation
board bring-up
device drivers
peripheral buses