Principal Chip Lead, Silicon Co-Design Group

Nvidia

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Santa Clara, CA
Salary
$232,000–$368,000 / yr
Employment
Full-time
Posted
34 days ago
Freshness
Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $220k
This role $300k
$148k $392k
below market most similar roles pay here above market

This role pays more than 94% of similar roles. Most pay $189,737–$250,050 — the blue band above. At the midpoint, this role pays about $300k versus about $220k for comparable roles.

Based on 240 similar postings.

Employer

About Nvidia

Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing

Nvidia currently has 1623 open roles on FindRole.

Listed pay typically runs $184,000–$287,500 across 1110 roles with salary data.

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At a glance

TL;DR · Principal Chip Lead, Silicon Co-Design Group

The Principal Chip Lead joins the Silicon Co-Design Group to serve as the technical lead for a consequential silicon program. This role is responsible for the technical integrity of the chip end-to-end, acting as the single point of contact for multi-functional decisions and trade-offs. You will co-lead feature integration from chip to system, resolve complex multi-functional bugs, and steward the qualification playbook. Key responsibilities include guiding mitigations for HBM, power and thermal, high-speed I/O, and packaging issues while shaping the technical narrative for executive leadership. The role requires a BS or MS in Electrical or Computer Engineering and over 15 years of experience in post-silicon bring-up, validation, or system integration. You must demonstrate expertise in SoC and ASIC architecture to solve ambiguous, multi-team failure modes.

What you'll do

  • Serve as the single technical point of contact for multi-functional decisions, issues, and trade-offs.
  • Co-lead program-level feature integration from chip to system while resolving inter-function dependencies.
  • Resolve complex multi-functional bugs by translating ambiguous symptoms into root-cause closures for HBM, power, thermal, and I/O.
  • Steward the qualification playbook and develop reusable methodologies for other programs.
  • Shape the technical narrative by presenting key risks and trade-offs as decision-ready options for executive leadership.
  • Lead the program’s Critical Debug and SCG Technical Execution forums.
  • Mentor other Chip Leads and contribute to group-wide methodology through post-mortems and technical write-ups.

What we're looking for

  • BS or MS in Electrical or Computer Engineering, or equivalent experience.
  • Over 15 years of experience in post-silicon bring-up, validation, or system integration leadership at a major semiconductor company.
  • Proven track record of working on multiple shipped silicon products.
  • Strong end-to-end understanding of SoC and ASIC architecture.
  • Recognized expertise in at least one subsystem such as HBM, SerDes, power and thermal, or packaging.
  • Experience guiding technical decisions across functional boundaries and translating silicon issues into options for executive audiences.
  • Prior experience as a Chip Lead, Project Tech Lead, or Principal/Distinguished Engineer on a flagship GPU, AI accelerator, CPU, or networking ASIC (preferred).
  • Patents, conference papers, invited talks, or recognized contributions to silicon validation, post-silicon debug, or co-design integration (preferred).

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