Principal Chip Lead

What you'll do

• Serve as the primary technical point of contact for multi-functional decisions and trade-offs.
• Co-lead program-level feature integration from chip to system while resolving inter-function dependencies.
• Resolve complex, multi-functional bugs in areas like HBM, power, thermal, and high-speed I/O.
• Steward the qualification playbook and develop reusable methodologies for other programs.
• Translate technical risks and trade-offs into decision-ready options for executive leadership.
• Mentor other Chip Leads and contribute to organization-wide methodology through post-mortems.
• Lead Critical Debug and Technical Execution forums to represent the chip's technical status.

What we're looking for

• Hold a BS or MS in Electrical Engineering, Computer Engineering, or equivalent experience.
• Possess over 15 years of experience in post-silicon bring-up, validation, or system integration leadership at a major semiconductor company.
• Demonstrate a proven track record of working on multiple shipped silicon products.
• Possess a strong end-to-end understanding of SoC and ASIC architecture.
• Exhibit recognized expertise in at least one subsystem such as HBM, SerDes, power and thermal, or packaging.
• Provide specific examples of silicon-level impact including faster bring-up, fewer escapes, yield recovery, or methodology contributions.
• Demonstrate the ability to guide technical decisions across functional boundaries without direct reporting authority.
• Translate sophisticated silicon issues into clear, decision-ready options for executive audiences.