Advanced Package Technology Engineer

Broadcom

Quick summary

Work type
On-site
Location
Fort Collins, CO · San Jose, CA
Salary
$120,000–$192,000 / yr
Posted
143 days ago
Closes
Jul 11, 2026

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $187k
This role $156k
$108k most similar roles pay here $233k

This role pays less than 75% of similar roles. Most pay $158,175–$216,250 — the shaded band above. At the midpoint, this role pays about $156k versus about $187k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 61 open roles on FindRole.

Listed pay typically runs $120,000–$192,000 across 60 roles with salary data.

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View all roles at Broadcom

At a glance

TL;DR · Advanced Package Technology Engineer

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As part of the WW ASIC product development team, this Advanced Package Technology Engineer will work closely with silicon and package design teams, marketing, NPI, assembly suppliers, and customers to develop cost-effective high-performance custom packaging solutions. Day-to-day responsibilities include providing expertise in 2.5D/3D technology, leading program management with external partners, engaging memory suppliers, interfacing with technical teams, supporting new design wins, and developing alternate sourcing strategies. The ideal candidate holds a Master's degree or PhD in Mechanical/Electrical/Electronics Engineering with extensive experience in advanced packaging technologies such as multi-layer ceramic substrates and interposers. Proficiency in thermal and mechanical modeling tools like APD, AutoCAD, and SolidWorks is essential, along with deep knowledge of silicon fabrication processes, bumping techniques, and assembly methodologies. This role requires strong project management skills and the ability to handle multiple concurrent programs while fostering collaboration across global teams.

Skills

2.5D 3D BGA Flip Chip Interposer Substrate Design CAD AutoCAD Solidworks APD Thermal Modeling Mechanical Modeling PCB Design Silicon Fabrication Quality Systems Industry Standards Project Management CI/CD

What you'll do

  • Lead the development and qualification of 2.5D/3D package technologies.
  • Manage program interfaces with external assembly partners for technology implementation.
  • Engage memory suppliers to define technology and quality requirements.
  • Develop cost-effective, high-performance custom packaging solutions.
  • Support new design wins, NPI, and volume production ramps.
  • Interface with cross-functional teams including DI, Pkg Design, Test Dev.

What we're looking for

  • Master's Degree or PhD in relevant engineering field with extensive experience.
  • 6+ years of hands-on experience in developing high-performance custom packaging solutions.
  • Deep expertise in 2.5D/3D technology development and advanced package technologies.
  • Extensive knowledge of silicon fabrication, bumping processes, and substrate design rules.
  • Experience in program management, supplier engagement, and memory supplier requirements definition.
  • Proficiency in thermal/mechanical modeling and PCB/CAD tool usage for optimization.
  • Strong problem-solving skills and ability to handle multiple concurrent projects.

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