This role pays less than
62%
of similar roles. Most pay
$155,013–$222,000
— the shaded band above.
At the midpoint, this role pays about
$174k
versus about
$189k
for comparable roles.
Based on 240 similar postings.
Employer
About Nvidia
Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing
Nvidia currently has
563 open roles
on FindRole.
Listed pay typically runs
$168,000–$264,500
across 556 roles with salary data.
NVIDIA seeks a Senior Package Layout Engineer to join its innovative team, focusing on the design and development of advanced IC substrates for cutting-edge products. This role involves collaborating closely with Technical Package Leads and various design teams to implement high-speed/density ASIC packages, perform substrate breakout patterns, optimize package pinout, and conduct feasibility studies to ensure optimal size, cost, and performance. Key responsibilities include using Cadence APD or SiP tool suite for routing, placement, stack-up, reference plane, and power distribution development, as well as creating symbols and CAD library databases. Ideal candidates hold a B.S. in Electrical Engineering with 5+ years of experience in PCB layout, preferably including HDI designs, substrate layout of wire bond and flip chip packages, and proficiency in Cadence APD or SiP tools. Experience with Virtuoso and Calibre is beneficial, as is familiarity with Valor.