CPU Power and Thermal Management Architect
Qualcomm
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How this pay compares to similar roles
This role pays more than 67% of similar roles. Most pay $200,087–$254,750 — the shaded band above. At the midpoint, this role pays about $250k versus about $227k for comparable roles.
Based on 240 similar postings.
Employer
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has 512 open roles on FindRole.
Listed pay typically runs $166,400–$249,600 across 512 roles with salary data.
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At a glance
Lead CPU Power and Performance Architect will serve as a technical leader ensuring that CPU Core and Cache complexes in embedded products meet performance requirements while operating within reliability, power delivery, and thermal management constraints. The role involves driving cross-functional alignment between core design teams and the Embedded Business Unit to translate product usage models into specific IP performance and power targets. Key responsibilities include managing power delivery architecture, packaging infrastructure, and thermal modeling across the product definition stack. The candidate will partner with modeling teams to define budget targets and work with advanced methodology leads on SoC architecture, rail designs, and low-power modes. Essential skills include a deep understanding of PDN and PI principles, including IR drop and noise budgeting, as well as experience in firmware, BIOS, and pre-silicon power and performance modeling.
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