IC Packaging Design Engineer

Amazon Inc

Confirmed live today High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $153,600–$215,000 / yr
Posted: 47 days ago
Freshness: Confirmed live today
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $172k

This role $184k

$135k $224k

below market most similar roles pay here above market

This role pays more than 76% of similar roles. Most pay $160,000–$184,300 — the blue band above. At the midpoint, this role pays about $184k versus about $172k for comparable roles.

Based on 240 similar postings.

Employer

About Amazon Inc

Amazon Inc. is the world''s largest e-commerce and cloud computing company, operating the Amazon marketplace, AWS cloud platform, Prime subscription services, Alexa voice AI, and logistics infrastructure. Industry: E-Commerce & Cloud Computing

Amazon Inc currently has 643 open roles on FindRole.

Listed pay typically runs $143,700–$194,400 across 636 roles with salary data.

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At a glance

TL;DR · IC Packaging Design Engineer

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IC Packaging Design Engineer, Amazon Leo will join the Amazon Leo team to design innovative product solutions for a constellation of Low Earth Orbit satellites providing broadband connectivity. Working with a cross-disciplinary staff and third-party suppliers, you will design packages for mm-wave beamforming SoCs and front-end modules, focusing on power-optimized solutions. Daily responsibilities include defining floorplans, bump maps, and ball maps, as well as selecting materials and performing thermal testing. You will utilize tools like HFSS and Momentum to run 3D electromagnetic simulations and perform signal integrity checks for package types including FCBGA, FCCSP, WLCSP, and QFN. The role requires expertise in RF fundamentals, power integrity, and high-speed routing while implementing AI-driven workflows to accelerate design iterations and optimize performance for high-volume production.

Skills

IC Packaging RF Design HFSS Momentum Signal Integrity Power Integrity 3D Electromagnetic Simulation FCBGA FCCSP WLCSP QFN SERDES Machine Learning Thermal Simulation S-parameters Impedance Matching

What you'll do

Define floorplans, bump maps, and ball maps for beamforming ICs with digital and RF chip designers.
Select package materials, stack-ups, and options while coordinating with vendors on thermal testing.
Complete layouts for various package types including FCBGA, FCCSP, WLCSP, and QFN.
Run 3D electromagnetic simulations using HFSS and Momentum to verify package and PCB designs.
Perform signal integrity checks and create package models to identify crosstalk and coupling issues.
Run thermal simulations for packages and PCBs in coordination with the thermal team.
Design and layout test and application PCBs for packages with the Antenna and EE teams.
Implement AI-driven workflows and automation to accelerate packaging design iterations and optimize performance.

What we're looking for

Bachelor's degree in Electrical Engineering or a related field.
5+ years of experience in RF design, preferably in an advanced node.
Proven track record of products reaching volume production.
Experience with RF communication systems.
Master's degree in Electrical or Communications Engineering or a related field (preferred).
7+ years of experience designing full-custom packages/PCBs for high performance chips (preferred).
U.S. citizen, national, permanent resident, or lawfully admitted refugee/asylee.
Export Control Requirement.

Senior RFIC Design Engineer

Amazon Inc

Sunnyvale, CA +1 123 days ago $213,000–$287,500

7+ yrs exp

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