IC Packaging Design Engineer

Amazon Inc

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $136,000–$184,000 / yr
Posted: 2 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $168k

This role $160k

$129k most similar roles pay here $201k

This role pays less than 65% of similar roles. Most pay $152,000–$184,000 — the shaded band above. At the midpoint, this role pays about $160k versus about $168k for comparable roles.

Based on 240 similar postings.

Employer

About Amazon Inc

Amazon Inc. is the world''s largest e-commerce and cloud computing company, operating the Amazon marketplace, AWS cloud platform, Prime subscription services, Alexa voice AI, and logistics infrastructure. Industry: E-Commerce & Cloud Computing

Amazon Inc currently has 457 open roles on FindRole.

Listed pay typically runs $143,700–$194,400 across 447 roles with salary data.

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At a glance

TL;DR · IC Packaging Design Engineer

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IC Packaging Design Engineer, Amazon Leo will join a cross-disciplinary team to design innovative solutions for mm-wave beamforming SoCs and front-end modules. The role involves collaborating with internal teams and third-party vendors to manage product definition, execution, and optimization while focusing on power-optimized designs. Key responsibilities include defining floorplans, bump maps, and ball maps; selecting materials and performing thermal testing; and completing layouts for package types such as FCBGA, FCCSP, WLCSP, and QFN. The engineer will perform 3D electromagnetic simulations using HFSS and Momentum, conduct signal integrity checks, and implement AI-driven workflows to accelerate design iterations. Required expertise includes RF design on advanced nodes, high-speed digital and analog interface routing, and knowledge of s-parameters and power integrity. This role addresses technical challenges in the development of satellite constellation hardware components.

Skills

IC Packaging RF Design HFSS Momentum Signal Integrity Power Integrity FCBGA FCCSP WLCSP QFN Machine Learning Automation SERDES Thermal Simulation S-parameters Impedance Matching

What you'll do

Define floorplans, bump maps, and ball maps for beamforming ICs with digital and RF chip designers.
Coordinate with package vendors on material selection, stack-ups, and thermal design.
Perform layout and cost/performance trade-off analysis for various package types like FCBGA and WLCSP.
Run 3D electromagnetic simulations in HFSS or Momentum to verify package and PCB designs.
Conduct signal integrity checks and create models to identify crosstalk and coupling issues.
Execute thermal simulations of packages and PCBs in collaboration with the thermal team.
Design and layout test and application PCBs for integrated packages.
Implement AI-driven workflows and automation to accelerate packaging design iterations.

What we're looking for

Candidates must be a U.S. citizen, national, permanent resident, or granted asylum/refugee status for export control compliance.
Bachelor's degree in Electrical Engineering or a related field.
5+ years of experience in RF design, preferably in an advanced node.
Proven track record of products reaching volume production.
Experience with RF communication systems.
Master's degree in Electrical or Communications Engineering or a related field (preferred).
7+ years of experience designing full-custom packages/PCBs for high performance chips (preferred).
Strong understanding of RF fundamentals, power integrity, and material properties (preferred).