IC Package Integration Lead

The IC Package Integration Lead joins the hardware team to lead package integration and architecture efforts while collaborating with cross-functional teams including Silicon, Packaging, and Systems engineering. This role involves driving package technology development to improve performance and lower costs, managing the transition of innovative packaging solutions from concept through high volume manufacturing, and coordinating with assembly partners for new product introduction and qualification. The candidate will create design documentation, rules, and risk assessments while ensuring packages meet electrical, mechanical, thermal, and reliability requirements. Key technical competencies include semiconductor packaging design, Si floor plan, package layout using Cadence APD or Allegro, signal integrity, power integrity, and material science. Specific domain expertise in cellular, connectivity, and PMU packaging is desired to solve complex challenges regarding high density interconnects and thermo-mechanical constraints.