Hardware Developer Intern

IBM

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: Poughkeepsie, NY
Employment: Intern
Posted: 10 days ago
Freshness: Confirmed live yesterday
Nearby: 55 roles within 25 mi

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Salary context

How this pay compares to similar roles

Similar $167k

$120k most similar roles pay here $214k

This listing doesn't post a salary. Most similar roles pay $130,293–$204,625.

Based on 240 similar postings.

Employer

About IBM

IBM is a US-based global technology company providing hybrid cloud, AI, consulting, enterprise software, and IT infrastructure products and services.

IBM currently has 506 open roles on FindRole.

Listed pay typically runs $174,632–$197,165 across 5 roles with salary data.

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At a glance

TL;DR · Hardware Developer Intern

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Hardware Developer Intern 2027 serves as a member of an elite engineering team focused on developing, testing, and providing customer support for hardware, firmware, and semiconductors. The role involves critical work on microprocessors and infrastructure components for zSystems, Power Systems, Storage, and Quantum Systems. Daily responsibilities include logic design and verification, physical design, signal and power integrity analysis, microelectronics packaging, and thermal design. Candidates will engage with technologies such as VHDL, Verilog, SPICE, and RTL while utilizing programming languages like C, C++, Python, or Java. The role requires familiarity with architectures including RISC-V, ARM, MIPS, and FPGAs. This position addresses the technical challenges of the quantum revolution and the AI era by ensuring high-performance hardware reliability for enterprise infrastructure and advanced computing systems.

Skills

VHDL Verilog RTL SPICE Python C C++ TCL Java UVM FPGA RISC-V ARM MIPS x86 Linux Git GDB Bash Perl Agile CAD 3D Modeling Circuit Simulation

What you'll do

Develop, test, and provide customer support for hardware, firmware, and semiconductors.
Perform logic (RTL) design, verification, and physical design for microprocessors and infrastructure components.
Conduct signal integrity, power integrity, and thermal analysis for high-performance systems.
Execute processor and system characterization to ensure product quality and performance.
Develop and test firmware architectures while performing failure analysis on hardware components.
Perform material analysis, characterization, and mechanical modeling for technology integration.
Design printed circuit boards (PCB) including physical layout and voltage regulation.
Provide field engineering support to resolve technical issues for IBM products.

What we're looking for

High School Diploma or GED is required.
A Bachelor's degree in a relevant engineering, science, or technology field is preferred.
Candidates should be pursuing or hold a degree in fields such as Electrical Engineering, Computer Science, Physics, or Mechanical Engineering.
Preferred candidates have at least three months of experience designing or manufacturing hardware products.
Basic knowledge of computer architecture (FPGAs, RISC-V, ARM) and programming languages like C/C++, Python, or Java is preferred.
Proficiency in hardware description languages (VHDL/Verilog) and circuit simulation tools (SPICE) is preferred.
Experience with microprocessor design, CAD tools, 3D modeling, and various hardware architectures is preferred.
Strong verbal and written communication skills are required.

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