Firmware Architect, High-Speed Interconnect

Amd

Confirmed live yesterday High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Austin, TXSanta Clara, CAMarkham, Ontario, Canada
Salary
$212,000–$318,000 / yr
Posted
134 days ago
Freshness
Confirmed live yesterday
Closes
May 21, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $216k
This role $265k
$148k most similar roles pay here $336k

This role pays more than 86% of similar roles. Most pay $177,250–$254,750 — the shaded band above. At the midpoint, this role pays about $265k versus about $216k for comparable roles.

Based on 240 similar postings.

Employer

About Amd

AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors

Amd currently has 474 open roles on FindRole.

Listed pay typically runs $166,400–$249,600 across 474 roles with salary data.

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At a glance

TL;DR · Firmware Architect, High-Speed Interconnect

As a Firmware Architect – High-Speed Interconnect (PCIe / OCI), you will join the Data Center organization to lead the definition and evolution of next-generation firmware architectures. You will be responsible for driving scalable, high-performance solutions for PCIe Gen 6/7/8 and emerging Optical Component Interconnect technologies. Your daily work involves shaping firmware architecture strategy, influencing silicon design decisions, and collaborating with hardware, system architecture, and platform software teams to deliver end-to-end solutions across pre- and post-silicon phases. You will also guide platform bring-up, debug, and optimization for complex I/O subsystems while ensuring alignment with industry standards like CXL. The role requires deep expertise in high-speed signaling constraints, memory hierarchy, and system-level flows such as boot, enumeration, link training, and error handling to solve critical interconnect challenges within server platforms.

What you'll do

  • Define and drive firmware architecture for next-generation I/O interconnects including PCIe Gen 7/8 and OCI.
  • Lead the adoption and integration of advanced interconnect technologies into server platforms.
  • Influence silicon design decisions and ensure alignment with industry standards like CXL and PCIe.
  • Partner with hardware, software, and validation teams to deliver end-to-end system solutions.
  • Guide platform bring-up, debug, and optimization for complex I/O subsystems in production environments.
  • Monitor and integrate emerging trends in high-speed interconnect ecosystems.
  • Manage firmware design for complex hardware/software interfaces including boot, enumeration, and link training.

What we're looking for

  • Bachelor's or Master's degree in Computer Science, Computer Engineering, Electrical Engineering, or equivalent.
  • Extensive experience in firmware and system architecture with a focus on high-speed I/O and interconnect technologies (preferred).
  • Deep expertise in PCIe (Gen 4/5/6+) with familiarity in PCIe Gen 7/8 and Optical Interconnect technologies (preferred).
  • Strong understanding of server platform architecture, including CPU/GPU interconnects, memory hierarchy, and high-speed signaling constraints (preferred).
  • Proven experience in firmware design for complex hardware/software interfaces and system-level flows (preferred).
  • Experience with platform bring-up, pre/post-silicon validation, and debugging complex I/O and firmware issues (preferred).
  • Demonstrated ability to influence architecture and drive cross-organizational alignment (preferred).
  • Excellent communication skills to operate effectively at architecture, implementation, and executive levels (preferred).

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