FBAR Filter Designer

Broadcom

Confirmed live today High trust

Quick summary

Work type
On-site
Location
San Jose, CA
Salary
$121,900–$195,000 / yr
Employment
Full-time
Posted
18 days ago
Freshness
Confirmed live today
Closes
Feb 28, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $200k
This role $158k
$109k most similar roles pay here $244k

This role pays less than 83% of similar roles. Most pay $168,200–$231,300 — the shaded band above. At the midpoint, this role pays about $158k versus about $200k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 172 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 125 roles with salary data.

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View all roles at Broadcom

At a glance

TL;DR · FBAR Filter Designer

The FBAR Filter Designer leads the development of high-performance RF Front-End solutions, managing the full design lifecycle from acoustic resonator synthesis to full module integration for 5G and Wi-Fi standards. This role involves designing high-Q FBAR filters and multiplexers using optimized topologies, performing physical die layout and floor planning to manage parasitics and thermal dissipation, and conducting 3D EM simulations to model package-level interconnects. The designer ensures signal integrity across acoustic dies, laminates, and PCBs while performing Monte Carlo and corner analyses for high-volume manufacturing. Required expertise includes FBAR, BAW, or SAW physics and RF microwave circuit theory. Candidates must demonstrate proficiency in ADS and 3D EM tools like HFSS, CST, or Sonnet to address complex technical trade-offs regarding carrier aggregation and coexistence specifications within the RFFE architecture.

What you'll do

  • Design high-Q FBAR filters and multiplexers using optimized topologies.
  • Manage physical die layout and package integration to optimize for parasitics and thermal dissipation.
  • Manage the interface between acoustic die, laminate, and PCB to ensure signal integrity.
  • Lead 3D EM simulations to model package-level parasitics, interconnects, and coupling.
  • Perform Monte Carlo and corner analyses to ensure robust performance for high-volume manufacturing.
  • Correlate simulation results with measured lab data to drive design iterations.

What we're looking for

  • A PhD in EE/Physics with 3+ years experience or a Master's degree with 7+ years experience in RF/Microwave design is required.
  • Candidates must have experience in acoustic filter or RFFE module design.
  • Proven track record of successful tape-outs or high-volume product releases is required.
  • Deep understanding of FBAR, BAW, or SAW physics and RF/microwave circuit theory is required.
  • Expert proficiency in ADS and 3D EM tools such as HFSS, CST, or Sonnet is required.
  • Strong grasp of RFFE architectures, including carrier aggregation and coexistence specifications, is required.
  • Ability to perform Monte Carlo and corner analyses for high-volume manufacturing is required.
  • Excellent verbal and written communication skills are required.

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