FBAR Filter Designer

Broadcom

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Quick summary

Work type
On-site
Location
San Jose, CA
Salary
$143,800–$230,000 / yr
Employment
Full-time
Posted
39 days ago
Freshness
Confirmed live today
Closes
Feb 5, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $200k
This role $187k
$133k most similar roles pay here $243k

This role pays less than 55% of similar roles. Most pay $168,000–$231,300 — the shaded band above. At the midpoint, this role pays about $187k versus about $200k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 172 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 125 roles with salary data.

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At a glance

TL;DR · FBAR Filter Designer

The FBAR Filter Designer will lead the development of high-performance RF Front-End solutions, managing the entire design lifecycle from acoustic resonator synthesis to full module integration for 5G and Wi-Fi standards. The role involves designing high-Q FBAR filters and multiplexers, performing physical die layout and floor planning, and conducting 3D EM simulations to model package-level parasitics and interconnects. You will manage the interface between acoustic dies, laminates, and PCBs while ensuring signal integrity through Monte Carlo and corner analyses for high-volume manufacturing. Required expertise includes FBAR, BAW, or SAW physics, along with proficiency in ADS and 3D EM tools like HFSS, CST, or Sonnet. The position addresses technical challenges in RFFE architectures, including carrier aggregation and coexistence specifications, to bridge the gap between die-level physics and system-level hardware.

What you'll do

  • Design high-Q FBAR filters and multiplexers using optimized topologies.
  • Manage the physical die layout and package integration to optimize for parasitics and thermal dissipation.
  • Manage the interface between acoustic dies, laminates, and PCBs to ensure signal integrity.
  • Lead 3D EM simulations to model package-level parasitics, interconnects, and coupling.
  • Perform Monte Carlo and corner analyses to ensure robust performance for high-volume manufacturing.
  • Correlate simulation results with measured lab data to drive design iterations.

What we're looking for

  • A PhD in EE/Physics with 7+ years of experience or a Master's degree with 10+ years of experience in RF/Microwave design is required.
  • Candidates must have expertise in FBAR, BAW, or SAW physics or extensive experience in RFFE module integration and RF/microwave circuit theory.
  • Expert proficiency in ADS and 3D EM tools such as HFSS, CST, or Sonnet is required.
  • Experience with high-Q FBAR filter and multiplexer design using optimized topologies is required.
  • Proven track record of successful tape-outs or high-volume product releases is required.
  • Strong grasp of RFFE architectures, including carrier aggregation and coexistence specifications, is required.
  • Ability to perform 3D EM simulations for package-level parasitics, interconnects, and coupling is required.
  • Excellent verbal and written communication skills are required to explain technical trade-offs to cross-functional teams.

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