ECAD Principal Engineer

Arm Holdings

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Chandler, AZ
Salary
$249,900–$338,100 / yr
Posted
8 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $210k
This role $294k
$128k most similar roles pay here $361k

This role pays more than 92% of similar roles. Most pay $177,900–$241,550 — the shaded band above. At the midpoint, this role pays about $294k versus about $210k for comparable roles.

Based on 240 similar postings.

Employer

About Arm Holdings

Arm Holdings plc is a leading British semiconductor and software design firm, established in 1990 and recognized for developing energy-efficient processor architectures that power nearly all smartphones and a vast range of IoT and computing devices.

Arm Holdings currently has 105 open roles on FindRole.

Listed pay typically runs $209,100–$282,900 across 105 roles with salary data.

Most-posted roles

View all roles at Arm Holdings

At a glance

TL;DR · ECAD Principal Engineer

The ECAD Principal Engineer joins the System-in-Package team to focus on tools and process implementation for next-generation SoCs in the IoT, Automotive, and Compute spaces. This role involves designing and developing tools to support package designs, coordinating with multiple teams to architect automation for data transfer, and communicating with vendors regarding development requirements. The engineer will develop symbols and CAD library databases using Cadence APD tools, create methodologies to improve layout efficiency, and perform layout development focusing on DFM, DFA, Signal, and Power Delivery Networks. Required expertise includes 2.5D and 3D package systems, Cadence APD, Allegro, Siemens HyperLynx, Ansys, and Valor. Technical proficiency is required in programming languages such as SKILL, TCL, Ravel, Codex, and Python to develop custom tools for large layout installations while providing internal use model support across the design cycle.

What you'll do

  • Design and develop tools to support package designs for next-generation SoCs.
  • Architect and develop automation to facilitate data transfer and checking between multiple teams.
  • Coordinate with ECAD vendors regarding new development requirements, problem reports, and resolutions.
  • Develop symbols and CAD library databases using Cadence APD tools.
  • Create methodologies to improve layout efficiency for 2.5D and 3D package systems.
  • Perform layout development following best practices for DFM, DFA, Signal, and Power Delivery Networks.
  • Provide use model support and technical guidance to internal team members across the design cycle.

What we're looking for

  • An Electrical Engineering degree or equivalent work experience.
  • Experience with 2.5D and 3D package systems and facilitating layout process improvements.
  • 15+ years of recent experience in the use of Cadence APD & Allegro toolsets (including V24, V25), Siemens HyperLynx, Ansys, and Valor.
  • Substantial experience with programming languages such as SKILL, TCL, Ravel, Codex, Python, and others.
  • Significant experience in the design, development, and deployment of Custom Tools in large layout installations.
  • Demonstrated history of Product support and internal regression testing and techniques.
  • Experience with Siemens Expedition, Calibre, Innovus, or other tools (preferred).
  • Ability to use SI/PI tools, run early analysis, and provide feedback (preferred).

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