IC Package Design Technical Leader
Cisco
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How this pay compares to similar roles
This role pays more than 88% of similar roles. Most pay $166,562–$223,700 — the shaded band above. At the midpoint, this role pays about $253k versus about $195k for comparable roles.
Based on 240 similar postings.
Employer
Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing
Nvidia currently has 563 open roles on FindRole.
Listed pay typically runs $168,000–$264,500 across 556 roles with salary data.
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At a glance
The Silicon Co-Design Group at NVIDIA is seeking a Chip Lead to serve as the technical lead for one of its critical silicon programs, ensuring the program’s technical integrity from early architecture through final product delivery. This role involves partnering across design, validation, software, and manufacturing teams to resolve complex multi-functional issues and guide feature integration. Day-to-day responsibilities include serving as the single point of contact for technical decisions, resolving challenging bugs related to HBM, power and thermal management, high-speed I/O, and packaging, and stewarding the qualification playbook. The ideal candidate has over a decade of experience in post-silicon bring-up, validation, or system integration at a major semiconductor company, with expertise in SoC and ASIC architecture and recognized contributions to silicon-level impact. Strong mentorship skills and the ability to build reusable technical methodologies are essential, as is comfort working across global teams and translating sophisticated issues into clear recommendations for executive leadership.
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