Camera SIPI Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$122,700–$184,800 / yr
Posted
58 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $189k
This role $154k
$110k most similar roles pay here $237k

This role pays less than 77% of similar roles. Most pay $157,375–$219,862 — the shaded band above. At the midpoint, this role pays about $154k versus about $189k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Camera SIPI Engineer

As a Camera SIPI Engineer within the Camera Technologies group, you will contribute to the design and development of innovative camera hardware for various products, including wide, ultra-wide, telephoto, and front-facing modules. You will model and analyze camera sub-system SI/PI performance, evaluate component-level EM desense and susceptibility risks, and provide recommendations for design optimization. Your daily work involves collaborating with system teams on high-speed channel and power delivery network budgeting, participating in feasibility studies for future technologies, and developing new simulation methodologies for sign-off analysis. You will utilize tools such as HFSS, SI-Wave/PSI, Q3D, CST, and ADS to perform simulations across substrate, package, flex, and PCB levels. Additionally, you will use VNA, TDR, and Oscilloscopes for testing, while utilizing JMP for statistical analysis and Python for automating simulation setups.

What you'll do

  • Model and analyze camera sub-system SI/PI performance and component-level EM risks.
  • Provide feedback and recommendations for hardware design optimization based on analysis.
  • Drive new design characterization, validation, and correlation tasks.
  • Budget high-speed channels and power delivery networks for camera feature integration.
  • Participate in feasibility studies for future camera technologies.
  • Develop new simulation methodologies for sign-off analysis.
  • Perform SI/PI simulations across substrate, package, flex, and PCB levels.
  • Use Python scripting to automate simulation setups and JMP for statistical analysis.

What we're looking for

  • Bachelor's degree in Electrical Engineering or a related field.
  • Master's or PhD in Electrical Engineering with at least 3 years of industry experience is preferred.
  • Experience in high-speed signal and power delivery network (PDN) fundamentals.
  • Proficiency with mainstream toolchains such as HFSS, SI-Wave/PSI, Q3D, CST, and/or ADS.
  • Experience performing substrate, package, flex, and PCB level SI/PI simulations.
  • Ability to operate VNA, TDR, and Oscilloscopes in academic or professional settings.
  • Proficiency in Python scripting for automating simulation setups and JMP for statistical analysis.
  • Knowledge of image sensors, camera modules, or electromagnetic concepts is preferred.

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