Camera SIPI Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$142,300–$214,300 / yr
Posted
107 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $188k
This role $178k
$132k most similar roles pay here $235k

This role pays less than 53% of similar roles. Most pay $156,750–$219,862 — the shaded band above. At the midpoint, this role pays about $178k versus about $188k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Camera SIPI Engineer

As a Camera SIPI Engineer within the Camera Technologies group, you will join the Camera Hardware Engineering team to design and develop groundbreaking camera systems ranging from sensors to lenses. You will be responsible for modeling and analyzing camera sub-system SI/PI performance, assessing component-level EM desense and susceptibility risks, and providing recommendations for design optimization. Your daily work involves collaborating with system teams on high-speed channel and power delivery network budgeting, conducting feasibility studies for future technologies, and developing new simulation methodologies for sign-off analysis. To succeed, you must possess expertise in high-speed signal and PDN fundamentals using tools like HFSS, SI-Wave/PSI, Q3D, CST, or ADS. Additional technical skills include utilizing VNA, TDR, and Oscilloscopes, performing statistical analysis in JMP, and using Python for automating simulation setups within the camera module domain.

What you'll do

  • Model and analyze camera sub-system SI/PI performance and component-level EM risk.
  • Provide feedback and recommendations for hardware design optimization based on analysis.
  • Drive new design characterization, validation, and correlation for camera components.
  • Budget high-speed channels and power delivery networks for camera feature integration.
  • Participate in feasibility studies for future camera technologies.
  • Develop new simulation methodologies for sign-off analysis.
  • Perform SI/PI simulations across substrate, package, flex, and PCB levels.

What we're looking for

  • Bachelor of Science in Electrical Engineering or a related field.
  • Master's or PhD in Electrical Engineering with at least 3 years of industry experience is preferred.
  • Experience in high-speed signal and power delivery network (PDN) fundamentals.
  • Proficiency with mainstream toolchains such as HFSS, SI-Wave/PSI, Q3D, CST, and/or ADS.
  • Experience performing substrate, package, flex, and PCB level SI/PI simulations.
  • Ability to operate VNA, TDR, and Oscilloscopes in academic or professional settings.
  • Proficiency in Python scripting for automating simulation setups and JMP for statistical analysis.
  • Knowledge of image sensors, camera modules, or electromagnetic concepts is preferred.

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