As an Associate Quantum Hardware Mechanical Engineer, you will join a specialized team focused on developing IBM Quantum systems through the fabrication, assembly, and characterization of precision components used in quantum computing hardware. This hands-on, laboratory-based role involves performing precision machining, executing experiments, and conducting component characterization in close collaboration with electrical engineers, fabrication engineers, and experimental physicists. You will be responsible for troubleshooting complex technical challenges and ensuring high-quality work while contributing to the development of next-generation quantum systems. The ideal candidate possesses a degree in a relevant field such as Mechanical Engineering, Physics, or Materials Science. Preferred skills include creating CAD models for mechanical components and experience conducting hands-on experimental work using laboratory equipment. This role addresses the technical challenges of building advanced hardware necessary for practical, large-scale quantum computing applications.
Support ongoing research and development efforts for next-generation quantum hardware.
What we're looking for
Bachelor's degree in a relevant field such as Materials Science, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or Applied Physics.
Ability to independently troubleshoot complex technical challenges and solve problems.
Strong communication and collaboration skills for working within interdisciplinary teams.
Growth mindset and willingness to learn new skills and technologies.
Attention to detail and commitment to high-quality work.
Experience conducting hands-on experimental work using laboratory equipment is preferred.
Ability to create CAD models for mechanical components is preferred.
Must have the ability to work without a need for current or future visa sponsorship.
Quantum Computing
High Performance Computing
AI
Hybrid Cloud
Microwave Electronics
Test Automation
Cryogenics
Circuit Test
Low Noise Measurement
Qubit Calibration
Signal Delivery
Control Electronics
Change Control
Surface Mount Technology (SMT)
Die Attach
Flip-chip Assembly
Soldering
Optical Microscopy
SEM
Metrology
Cross-sectioning
Electrical Testing
Statistical Process Control
design-of-experiments (DOE
Yield Analysis
Quantum Computing
High Performance Computing
AI
Hybrid Cloud