The Associate Quantum Hardware Assembly R&D Engineer joins the Quantum Hardware team to develop advanced electronic packaging technologies for next-generation superconducting qubit systems. This role involves researching, developing, and fabricating assembly processes such as surface mount technology, die attach, and flip-chip assembly. The engineer will perform electrical, mechanical, and physical characterization to evaluate assembly yields and package performance while troubleshooting hardware integration issues. Key responsibilities include documenting experimental methods through technical reports and collaborating with multidisciplinary teams of engineers and physicists. Candidates should possess a strong technical foundation in fields like materials science, electrical engineering, or physics. Preferred skills include experience with optical microscopy, SEM, cross-sectioning, metrology, and basic electrical testing. The role focuses on solving complex packaging challenges to advance the development and maturation of quantum hardware technologies.
Develop and optimize assembly processes for next-generation quantum devices including SMT, die attach, and flip-chip techniques.
Evaluate assembly yields and package performance using electrical, mechanical, and physical characterization methods.
Perform hardware integration and troubleshoot root causes of assembly and packaging issues.
Document experimental methods, results, and recommendations through technical reports and formal presentations.
Conduct research and development for advanced electronic packaging technologies in superconducting qubit systems.
Utilize state-of-the-art tools to characterize new hardware and manufacturing processes.
What we're looking for
Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.
Ability to independently troubleshoot and solve complex technical problems.
Ability to work effectively with interdisciplinary teams including engineers and scientists.
Strong growth mindset and willingness to learn new skills.
High attention to detail and commitment to quality work.
Academic, internship, or research experience in materials development, characterization, or process engineering is preferred.
Experience with electronic packaging techniques like SMT, die attach, flip-chip assembly, or soldering is a bonus.
Familiarity with microscopy, metrology, electrical testing, and statistical process control methodologies is a bonus.
Quantum Computing
High Performance Computing
AI
Hybrid Cloud
Microwave Electronics
Test Automation
Cryogenics
Circuit Test
Low Noise Measurement
Qubit Calibration
Signal Delivery
Control Electronics
Change Control