Process Engineer V

Applied Materials

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$163,000–$224,000 / yr
Employment
Full-time
Posted
15 days ago
Freshness
Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $181k
This role $194k
$130k $234k
below market most similar roles pay here above market

This role pays more than 67% of similar roles. Most pay $147,125–$214,000 — the blue band above. At the midpoint, this role pays about $194k versus about $181k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 337 open roles on FindRole.

Listed pay typically runs $124,000–$171,000 across 219 roles with salary data.

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At a glance

TL;DR · Process Engineer V

The Process Engineer V joins the R&D team to extend heterogeneous integration flows into co-packaged optics. This role involves developing and integrating modules that combine photonic and electronic die, optical engines, and fiber interfaces. The engineer will address specific integration requirements, including optical coupling, alignment, optical loss, and thermal management near photonic components. Key responsibilities include creating technology roadmaps, performing risk assessments, and leading alpha engineering activities for CPO process technology. The position requires expertise in silicon photonics, photonic integrated circuits, and heterogeneous integration modules like hybrid bonding, TSVs, and fine-pitch interconnects. Candidates must utilize DOE, statistical analysis, and root-cause skills to solve complex problems. The work focuses on solving optical and thermal challenges unique to co-packaged optics within the semiconductor and display manufacturing industries.

What you'll do

  • Extend heterogeneous integration flows to co-packaged optics by integrating photonic and electronic die, optical engines, and fiber interfaces.
  • Address CPO-specific integration requirements including optical coupling, alignment, optical loss, and thermal management.
  • Create technology roadmaps, risk assessments, and executive-ready reports for co-packaged optics development.
  • Lead the research, development, and implementation of new CPO modules and existing heterogeneous integration capabilities.
  • Resolve complex process and integration issues for key customers to address their High Value Problems.
  • Identify invention opportunities and contribute to the company's intellectual property portfolio.
  • Lead alpha engineering activities for CPO process technology and support the release of new module capabilities.
  • Select and manage relationships with vendors, suppliers, and ecosystem partners to support R&D goals.

What we're looking for

  • MS or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related field.
  • Significant experience as a module process engineer or process integrator in semiconductor R&D or advanced technology development.
  • Hands-on experience with co-packaged optics (CPO), silicon photonics, photonic integrated circuits, or optical engines.
  • Working knowledge of photonic/electronic die integration, optical coupling and alignment, fiber attach, optical loss, and thermal management.
  • Experience with heterogeneous integration modules such as hybrid or fusion bonding, D2W/W2W integration, TSVs, fine-pitch interconnects, or interposers.
  • Strong DOE, statistical analysis, and root-cause skills across optical, electrical, physical, and reliability data.
  • Proven ability to lead multidisciplinary projects and communicate clearly with engineers, executives, customers, and partners.
  • Record of patents, publications, or invited talks in CPO, photonics, or advanced packaging (preferred).

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