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Advanced Packaging Integration Engineer

Applied Materials

Santa Clara, CA 75 days ago $161,000–$221,000
Actively hiring Confirmed live yesterday High trust Competitive pay
Advanced Packaging Hybrid Bonding 2.5D/3D Heterogeneous Integration Semiconductor Processing TSV RDL Underfill Bumping Molding OSAT Processes Micro-LED CPO Design of Experiments SPC JMP MES Statistical Data Analysis Process Optimization
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