This role pays less than
92%
of similar roles. Most pay
$132,906–$214,000
— the shaded band above.
At the midpoint, this role pays about
$80k
versus about
$173k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
367 open roles
on FindRole.
Listed pay typically runs
$166,400–$249,600
across 367 roles with salary data.
The 2027 Undergrad ASIC Package Engineering Co-op/Intern will join a team of engineers focused on bringing advanced packaging technology to reality. In this role, the individual will support package design and development by prioritizing and optimizing new projects while performing substrate, interposer, and bump designs for products, test vehicles, and probe card substrates. Key responsibilities include implementing design verification to ensure performance and quality, analyzing yield and defect metrics, and evaluating packaging materials to achieve cost-efficient designs. The ideal candidate possesses knowledge of semiconductor theory, transmission lines, and electric circuits. Preferred technical skills include experience with package, silicon, or PCB design software; scripting languages such as Perl, Python, or SQL; and data visualization tools like PowerBI. This role addresses the critical challenge of optimizing high-performance hardware through advanced packaging solutions.
Support Package Design and Development Engineers in prioritizing and optimizing new projects.
Complete substrate, interposer, and bump designs for products, test vehicles, and probe card substrates.
Implement design verification tasks to ensure product performance, quality, and efficiency.
Analyze yield and defect metrics to improve overall design performance.
Evaluate and benchmark packaging materials to achieve cost-efficient designs.
Interact with partners to meet specific performance and yield requirements.
What we're looking for
Must be currently enrolled in a US-based university in a Bachelor's degree program.
Major must be in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
Knowledge of transmission lines and electric circuits (preferred).
Experience with package, silicon, or PCB design software (preferred).
Proficiency in scripting languages such as Perl, Python, or SQL (preferred).
Knowledge of semiconductor theory and packaging process/technology (preferred).
Experience with data analytics and visualization tools like PowerBI (preferred).