This role pays less than
96%
of similar roles. Most pay
$132,906–$214,000
— the shaded band above.
At the midpoint, this role pays about
$74k
versus about
$173k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
367 open roles
on FindRole.
Listed pay typically runs
$166,400–$249,600
across 367 roles with salary data.
The 2027 Undergrad ASIC Package Engineering Co-op/Intern joins the engineering team to help bring advanced packaging technology to reality. In this role, you will support Package design and Development Engineers by prioritizing and optimizing new projects while performing substrate, interposer, and bump designs for products, test vehicles, and probe card substrates. You will also execute design verification implementations to ensure performance and quality, analyze yield and defect metrics, and evaluate packaging materials to achieve cost-efficient designs. The role requires knowledge of semiconductor theory, transmission lines, and electric circuits. Candidates should possess skills in package, silicon, or PCB design software; scripting languages like Perl, Python, or SQL; and data analytics tools such as PowerBI. This position focuses on solving technical challenges within the advanced packaging and semiconductor manufacturing domain.
Support Package design and Development Engineers in prioritizing and optimizing new projects.
Complete substrate, interposer, and bump designs for products, test vehicles, and probe card substrates.
Implement design verification tasks to ensure product performance, quality, and efficiency.
Analyze yield and defect metrics to improve overall design performance.
Evaluate and benchmark packaging materials to achieve cost-efficient designs.
Interact with partners to meet specific performance and yield requirements.
What we're looking for
Must be currently enrolled in a US-based university in a Bachelor's degree program.
Major must be in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
Knowledge of transmission lines and electric circuits (preferred).
Experience with package, silicon, or PCB design software (preferred).
Proficiency in scripting languages such as Perl, Python, or SQL (preferred).
Knowledge of semiconductor theory and packaging process/technology (preferred).
Experience with data analytics and visualization tools like PowerBI (preferred).