Wireless Module Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $118,000–$207,100 / yr
Posted: 13 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $185k

This role $163k

$106k most similar roles pay here $232k

This role pays less than 70% of similar roles. Most pay $158,825–$211,675 — the shaded band above. At the midpoint, this role pays about $163k versus about $185k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Wireless Module Engineer

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The Wireless Module Engineer serves as a technical lead within the Hardware Technology organization, driving wireless module development from early architecture definition through mass-production ramp. This role involves managing the full lifecycle of module integration and ATE test coverage at Outsourced Semiconductor Assembly & Test sites. Key responsibilities include leading RF design discussions, overseeing PCB layout reviews, performing yield analysis, and coordinating with cross-functional teams to ensure manufacturing readiness. The candidate will manage hardware and software components such as load boards, sockets, and firmware calibrations while troubleshooting I2C and PCIe interface issues. Required skills include strong RF fundamentals, data analysis for CPK and retest rates, and experience in packaging and reliability engineering. The role addresses the technical challenge of ensuring high-quality wireless performance across multiple product lines through disciplined execution and rigorous test coverage.

Skills

RF Design ATE Yield Analysis PCB Layout I2C PCIe Firmware Data Analysis DFM EVM Test VCO Calibration Reliability Engineering AI

What you'll do

Drive wireless module development from early architecture definition through mass production ramp.
Lead RF architecture and specification discussions between internal engineering teams and OSAT partners.
Manage ATE hardware and software maturity, including load boards, firmware, and calibration.
Oversee the formal design release process for schematics, PCB layouts, and DFM requirements.
Conduct failure analysis with OSATs to improve yield rates and optimize test times.
Translate product field-usage profiles into data-driven reliability test models for modules.
Act as the primary technical liaison between internal cross-functional teams and external manufacturing partners.
Travel internationally to perform module and ATE bring-up at various production sites.

What we're looking for

Must have a bachelor's degree.
Must possess strong RF fundamentals and a strong RF design background.
Preferred advanced degree in a technical discipline.
Preferred 2 or more years of wireless module development experience from concept to mass production for consumer electronics.
Experience in packaging, product engineering, ATE, and reliability engineering is highly desirable.
Must have strong data analysis skills including yield (Cpk) and retest rate analysis.
Ability to travel internationally for manufacturing and test bring-up.
Proven track record of effective written/verbal communication and project leadership.