The Advanced Packaging Technologist role at Applied Materials’ Disruptive Technology Pathfinding team requires a senior professional to lead complex technology and engineering development projects in advanced packaging process integration. This technologist will define and implement end-to-end process flows for panel-level packaging technologies, conduct material selection and characterization, and collaborate with business units on process development and optimization. Key responsibilities include partnering with customers to align process specifications, providing feedback on equipment product strategy, analyzing data for optimization, and presenting technical findings at industry conferences. The ideal candidate holds a Master’s degree or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field, with extensive experience in 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP) and interposer technology. Proficiency in semiconductor processing techniques like lithography, dry etch, and thin film deposition is essential, along with expertise in statistical data analysis tools like JMP and knowledge of industry standards for reliability requirements.
Skills
2.xD packaging
fan-out panel-level packaging
organic interposer
lithography
dry etch
thin film deposition
statistical data analysis
DoE
JMP
semiconductor packaging standards
process characterization
metrology
reliability requirements
qualification methodologies
multi-functional team leadership
technical presentations
executive-level communication
structured technical discussions
What you'll do
Lead development and enablement of next-generation 2.xD packaging concepts.
Define and implement end-to-end process flows for panel-level packaging technologies.
Conduct material selection and compatibility assessments for large form factor substrates.
Analyze process data to identify trends, optimize performance, and improve yield.
Design and execute complex engineering experiments within safety guidelines.
Publish and present technical findings at industry conferences and journals.
Mentor early-career engineers and provide technical direction and best practices.
What we're looking for
Master’s degree with 10 years or PhD with 5 years in relevant engineering fields.
Expertise in advanced 2.xD packaging technologies and related process flows.
Proficiency in semiconductor processing techniques including lithography, etch, thin films.
Strong understanding of process equipment, materials selection criteria, and performance trade-offs.
Proven capability to lead multi-functional teams resolving complex technical issues.
Ability to develop clear technical presentations and communicate effectively with executives.
Market check
Salary context
This
$176,000–$242,000
range sits above
66%
of similar postings on FindRole.
Peer median band
$140,000–$220,000
Median floor and ceiling across peers.
Typical midpoint (25–75%)
$145,581–$224,000
Middle half of comparable postings.
Based on 239 comparable postings.*
* 240 is the maximum number of comparable postings sampled.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
65 open roles
on FindRole.
Listed pay typically runs
$141,000–$193,500
across 65 roles with salary data.
San Diego, Ca,Us, US149 days ago
$154,000–$231,000
Flip Chip
Wire Bond
System in Package (SiP)
Design for Manufacturability (DFM)
Failure Mode and Effects Analysis (FMEA)
Laser Groove Technology
Package Manufacturing
Technical Project Management
Reliability Test Methods
Six Sigma
Usa - Mo - St Louis 875 Chesterfield, US22 days ago
$93,600–$156,000
Instron
ZebraSci
MIMAS
Computrac
HPLC
UPLC
SEC
LC-MS
BiaCORE
DSC
GC
cGMP
ISO 13485
FDA
ICH
USP
EP
JP compendia
combination product regulations
data processing
report writing
ChatGPT
Microsoft Copilot