Staff Packaging Engineer

Qualcomm

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $154,000–$231,000 / yr
Posted: 156 days ago
Closes: Jun 28, 2026
Nearby: 99+ roles within 25 mi

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $190k

This role $192k

$131k most similar roles pay here $256k

This role pays less than 52% of similar roles. Most pay $165,000–$214,500 — the shaded band above. At the midpoint, this role pays about $192k versus about $190k for comparable roles.

Based on 239 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 615 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 556 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Staff Packaging Engineer

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As a Staff Packaging Engineer at Qualcomm Technologies, Inc., you will lead the development and high-volume manufacturing of advanced integrated circuit packaging technologies for Data Center, AI, Power Management, Compute, and emerging markets. Your daily responsibilities include exploring new FCCSP, FCBGA, and SiP/Module packaging technologies, defining package process flows, collaborating with OSATs and material suppliers to ensure alignment with product requirements, and promoting Design for Manufacturability methodologies. You will manage complex technical programs, provide regular updates on progress, and demonstrate expertise in Flip Chip CSP, Wire Bond processes, and statistical data analysis. The role requires a strong background in electrical or mechanical engineering, experience with wafer-on-wafer bonding is preferred, and proficiency in Failure Mode and Effects Analysis, Statistical Process Control concepts, and reliability test methods.

Skills

Flip Chip Wire Bond System in Package (SiP) Design for Manufacturability (DFM) Failure Mode and Effects Analysis (FMEA) Laser Groove Technology Package Manufacturing Technical Project Management Reliability Test Methods Six Sigma

What you'll do

Develop and deploy advanced IC packaging technologies for high-volume manufacturing.
Define package process flows, material sets, and Best Known Methods (BKM) to ensure product reliability.
Coordinate with OSATs, substrate suppliers, and tool makers to align technology development with product requirements.
Implement Design for Manufacturability (DFM) methodology in collaboration with internal design teams.
Manage technical programs, providing regular updates on program status to management and cross-functional team members.
Demonstrate expertise in Failure Mode and Effects Analysis (FMEA), SPC/QC concepts, and quality issue resolution.

What we're looking for

At least 8 years of experience in advanced IC packaging development and high-volume manufacturing.
Expertise in Flip Chip CSP, FCBGA, SiP assembly processes, materials, equipment, and design rules.
Strong leadership skills for managing multi-functional teams and solving complex technical problems.
Demonstrated ability to work independently on multiple programs with excellent communication skills.
Experience in package process flows, material sets, Best Known Methods (BKM), test vehicles, and DOE cornering.
Knowledge of Failure Mode and Effects Analysis (FMEA) and Statistical Process Control/Quality Control (SPC/QC) concepts.

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