Sr. Staff Packaging Engineer

Qualcomm

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $180,400–$270,600 / yr
Posted: 46 days ago
Closes: Oct 17, 2026
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $190k

This role $226k

$128k most similar roles pay here $286k

This role pays more than 83% of similar roles. Most pay $165,000–$214,500 — the shaded band above. At the midpoint, this role pays about $226k versus about $190k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 621 open roles on FindRole.

Listed pay typically runs $148,300–$224,400 across 562 roles with salary data.

Most-posted roles

View all roles at Qualcomm

At a glance

TL;DR · Sr. Staff Packaging Engineer

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Join Qualcomm Technologies as a senior packaging engineer where you will develop advanced 2.5D packaging technologies and define baseline assembly processes for high-performance computing applications. You will work closely with cross-functional teams to optimize performance, reliability, yield, and cost across various product lines, manage multiple foundries and OSATs, and resolve complex technical issues. Essential skills include hands-on experience with FCBGA/LGA and FCCSP assembly processes, die prep, chip attach, underfill, lid/stiffener attach, ball attach, process optimization, material selection, DOE planning, execution, and data analysis. Preferred qualifications involve a master’s degree in Mechanical, Electrical or Materials Engineering, extensive experience in packaging technology development, knowledge of semiconductor industry trends, reliability standards, and the ability to lead multi-functional teams.

Skills

FCBGA LGA FCCSP DOE ABF EMIB wafer bumping project management communication skills reliability standards test methods qualification procedures failure analysis techniques substrate manufacturing processes technical project management

What you'll do

Develop advanced 2.5D packaging technologies for high performance computing.
Define and optimize baseline assembly processes for multiple product applications.
Lead cross-functional teams to resolve complex technical issues in packaging.
Manage relationships with foundries and OSATs for new process development.
Work with suppliers to bring up new processes and drive NPI/HVM deployment.
Conduct DOE planning, execution, and data analysis for process optimization.

What we're looking for

Extensive experience in 2.5D package technology development including architecture definition and assembly processes.
Hands-on expertise with FCBGA/LGA and FCCSP assembly techniques, process optimization, and material selection.
Strong analytical skills for DOE planning, execution, and data analysis in semiconductor packaging.
Ability to lead cross-functional teams and manage multiple foundries and OSATs.
Knowledge of reliability standards, test methods, qualification procedures, and failure analysis techniques.
Familiarity with substrate manufacturing processes and design rules in high-performance computing products.

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