Structural/ Thermal Modeling Engineer 3

Lam Research

Hybrid

Quick summary

Work type
Hybrid
Location
Tualatin, OR
Posted
60 days ago
Closes
Oct 11, 2026

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How this pay compares to similar roles

Similar $170k
$120k most similar roles pay here $209k

This listing doesn't post a salary. Most similar roles pay $139,000–$200,715.

Based on 239 similar postings.

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About Lam Research

Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.

Lam Research currently has 376 open roles on FindRole.

Listed pay typically runs $105,000–$231,000 across 184 roles with salary data.

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At a glance

TL;DR · Structural/ Thermal Modeling Engineer 3

As a Senior Research Scientist in Lam Research’s Semiconductor Equipment R&D team, you will focus on developing physics-based models for Thermo-Elastic, Structural, and CFD applications using commercial software like ABAQUS, ANSYS, NASTRAN, and COMSOL. Your day-to-day responsibilities include integrating data-driven AI/ML methods to enhance engineering designs through DOE, optimization, and statistical analysis, while also conducting multi-scale modeling from nano to macro levels. You will collaborate closely with mechanical, electrical, process, and software engineers to define design requirements and conduct simulations for semiconductor manufacturing equipment. Essential skills include a PhD in Mechanical Engineering or related field, proficiency in AI/ML concepts, coding abilities, and strong communication skills. Preferred expertise includes big data, multi-physics modeling, HPC, cloud computing, numerical methods, thin film mechanics, ceramic materials, fracture mechanics, uncertainty quantification, and statistical theory.

What you'll do

  • Develop physics-based models for Thermo-Elastic, Structural, and CFD applications using commercial software like ABAQUS or ANSYS.
  • Translate tool operational data into improved engineering designs through AI/ML methods and statistical analysis.
  • Provide design improvements for in-service tools based on quantitative field failure data and quality metrics.
  • Use advanced statistical and probabilistic methods to quantify the design and performance of semiconductor manufacturing equipment systems.
  • Conduct multi-scale modeling from nano, meso to macro levels for mechanical components in semiconductor capital equipment.
  • Collaborate with cross-functional engineering teams to define design requirements and simulation plans.

What we're looking for

  • PhD in Mechanical Engineering or related field with focus on solid mechanics, heat transfer, and fluid mechanics.
  • Strong understanding of AI/ML concepts and ability to integrate physics-based modeling with data-driven methods.
  • Experience developing physics-based models using commercial software like ABAQUS, ANSYS, COMSOL.
  • Ability to code supplementary tools for specific applications in commercial software.
  • Proficiency in multi-scale modeling from nano to macro levels and uncertainty quantification techniques.
  • Strong written and oral communication skills with capability to lead design reviews in cross-functional teams.

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