Structural/ Thermal Modeling Engineer 3 joins the Global Products Group to develop physics-based models for Thermo-Elastic, Structural, and CFD applications within the semiconductor capital equipment industry. The role involves creating multi-scale models from nano to macro levels and integrating data-driven AI/ML methods with traditional physics to improve engineering designs. Key responsibilities include utilizing DOE, optimization, and statistical methods to correlate simulation data with experimental results, performing uncertainty quantification, and providing design improvements based on field failure data. Candidates must possess a PhD in Mechanical Engineering or a related field, focusing on solid mechanics, heat transfer, and fluid mechanics. Required skills include coding to supplement commercial software like ABAQUS, ANSYS, NASTRAN, or COMSOL. The work addresses complex technical challenges in semiconductor manufacturing equipment, specifically involving multi-physics modeling and material characterization in vacuum environments.