The Metrology Engineer 3 joins the Global Products Group to develop next-generation on-tool metrology and sensing technologies for semiconductor manufacturing. This role involves building spectroscopy, imaging, and vision-based systems to enable real-time characterization of film thickness, uniformity, and defectivity directly on processing equipment. You will design experiments to quantify measurement uncertainty, perform MSA and Gauge R&R, and develop calibration methods. Key responsibilities include building algorithms for signal processing, sensor fusion, and anomaly detection using physics-based and machine learning techniques. You will utilize tools such as Python, MATLAB, R, and JMP to transform optical and spectral signals into actionable process insights. The work focuses on solving technical challenges in equipment intelligence, optical subsystem optimization, and non-contact wafer characterization to improve manufacturing productivity.