As a Modeling Engineer 3 within the WETS Product Group, you will join a cross-disciplinary team focused on liquid-based processing technologies for semiconductor advanced packaging. You will manage the full lifecycle of computational modeling projects to support product and process development for wafer and panel systems. Your daily responsibilities include building multiphysics models—including Computational Fluid Dynamics (CFD), Finite Element Analysis (FEA), and electrochemical models—to simulate structural, flow, thermal, chemical reaction, and mass transport conditions. You will utilize tools such as ANSYS Fluent, COMSOL Multiphysics, ANSYS Mechanical, or Abaqus to inform design decisions and conduct experiments for validation. The role requires expertise in hydrodynamics, structural mechanics, and potentially electroplating systems or microbubbles. You will also perform non-linear analysis, develop intellectual property, and collaborate with global teams to solve complex engineering challenges in the semiconductor capital equipment space.