Staff Product Manager, Data Center High-Speed Connectivity & AI Infrastructure

Qualcomm

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$208,200–$312,200 / yr
Posted
40 days ago
Freshness
Confirmed live today
Closes
Mar 16, 2027
Nearby
99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $231k
This role $260k
$166k $328k
below market most similar roles pay here above market

This role pays more than 72% of similar roles. Most pay $198,050–$263,183 — the blue band above. At the midpoint, this role pays about $260k versus about $231k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 575 open roles on FindRole.

Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.

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At a glance

TL;DR · Staff Product Manager, Data Center High-Speed Connectivity & AI Infrastructure

Role Posting Log in to save

The Staff Product Manager - Data Center High-Speed Connectivity & AI Infrastructure joins the Data Center Business Unit to define next-generation connectivity solutions for hyperscale AI infrastructure. This role involves driving product strategy, roadmap definition, and execution for high-speed technologies that enable AI scale-up and scale-out systems. Key responsibilities include developing market requirements, engaging with hyperscale customers and ecosystem partners, and leading cross-functional teams across architecture and engineering. The position requires expertise in high-speed connectivity technologies including PCIe, Ethernet, optical interconnects, die-to-die communication, and chiplet ecosystems. You will solve complex technical problems regarding scale-up fabrics, high-speed I/O, and rack-scale infrastructure. Success requires balancing performance, power efficiency, and cost while managing products from initial concept through market deployment for custom silicon platforms.

What does a Product Manager earn in California?

Median $222500 from 327 postings across 57 companies.

See salary data

Skills

PCIe Ethernet Optical Interconnects Die-to-Die Communication Chiplet Ecosystems High-Speed I/O Scale-up Fabrics Scale-out Architectures AI Infrastructure Hyperscale Data Centers HPC Systems Cloud Architectures Advanced Packaging Heterogeneous Integration SerDes Optical Networking

What you'll do

  • Define product strategy and multi-generation roadmaps for high-speed connectivity solutions supporting AI and cloud infrastructure.
  • Develop market requirements, customer use cases, and competitive positioning for next-generation connectivity technologies.
  • Engage directly with hyperscale customers and ecosystem partners to translate needs into product requirements.
  • Lead architecture and engineering teams to define system-level connectivity requirements and product capabilities.
  • Drive alignment across silicon, software, systems, packaging, and infrastructure organizations.
  • Develop business cases, investment recommendations, and pricing strategies for new products.
  • Manage product planning from initial concept through market deployment and adoption.
  • Track product success using measurable business, customer, and execution metrics.

What we're looking for

  • Bachelor's degree in Engineering, Information Systems, Computer Science, Humanities, or a related field.
  • 5+ years of Product Management or related work experience.
  • 10+ years of experience in semiconductor, networking, connectivity, or AI infrastructure markets (preferred).
  • Strong understanding of high-speed connectivity technologies including PCIe, Ethernet, optical interconnects, die-to-die communication, and chiplet ecosystems (preferred).
  • Experience with AI infrastructure, hyperscale data centers, HPC systems, or cloud architectures (preferred).
  • Understanding of scale-up and scale-out system architectures used in AI and machine learning deployments (preferred).
  • Familiarity with advanced packaging, heterogeneous integration, and high-bandwidth interconnect solutions (preferred).
  • Experience driving products from concept through deployment (preferred).

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