Staff Packaging Engineer

Qualcomm

Actively hiring Posted this week
San Diego, CA Posted 4 days ago $154,000–$231,000 / year
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At a glance

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TL;DR

Join Qualcomm Technologies as a Senior Packaging Engineer in their cutting-edge semiconductor division, where you will drive the development of advanced 2.5D packaging technologies and define baseline assembly processes optimized for high performance computing applications. Your daily tasks include leading cross-functional teams to manage multiple foundries and OSATs, resolving complex technical issues, and working closely with suppliers to bring up new processes and deploy them at scale. You will have hands-on experience with large body size FCBGA/LGA and FCCSP assembly, including die prep, chip attach, underfill, lid/stiffener attach, ball attach, process optimization, material selection, DOE planning, execution, and data analysis. This role requires a strong background in mechanical, electrical, or materials engineering, along with extensive experience in packaging technology development and semiconductor industry trends.

Skills

FCBGA LGA FCCSP die prep chip attach underfill lid/stiffener attach ball attach DOE planning ABF buildup substrate EMIB wafer bumping processes OSAT material selection equipment suppliers NPI HVM deployment reliability standards test methods qualification procedures failure analysis techniques substrate manufacturing processes technical project management

What you'll do

  • Develop advanced 2.5D packaging technologies for high performance computing.
  • Define and optimize baseline assembly processes for performance and cost efficiency.
  • Lead cross-functional teams to resolve complex technical issues in packaging.
  • Manage relationships with multiple foundries and OSATs for process development.
  • Work with suppliers to bring up new processes and drive NPI and HVM deployment.
  • Analyze data from DOE planning, execution, and material selection for optimization.

What we're looking for

  • Extensive experience in 2.5D package technology development including architecture definition and assembly processes.
  • Hands-on expertise with FCBGA/LGA and FCCSP assembly techniques, including process optimization and material selection.
  • Strong analytical skills for DOE planning, execution, and data analysis in packaging technology.
  • Ability to lead cross-functional teams and manage multiple foundries and OSATs.
  • Knowledge of reliability standards, test methods, qualification procedures, and failure analysis techniques.
  • Familiarity with substrate manufacturing processes and design rules in semiconductor packaging.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 595 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 540 roles with salary data.

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