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Staff Packaging Engineer

Qualcomm

San Diego, CA 7 days ago $154,000–$231,000
Actively hiring Posted this week Verified listing Competitive pay
FCBGA LGA FCCSP die prep chip attach underfill lid/stiffener attach ball attach DOE planning ABF buildup substrate EMIB wafer bumping processes OSAT material selection equipment suppliers NPI HVM deployment reliability standards test methods qualification procedures failure analysis techniques substrate manufacturing processes technical project management
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Staff Packaging Engineer

Danaher Corporation

Chaska, MN 9 days ago $140,000–$160,000
Actively hiring Verified listing Below market
SolidWorks CAD ISTA ASTM DOT ISO GMP UN4G DFM DFT Continuous Improvement Sustainability Automated Filling Lines Cold Chain Thermodynamics Cushion Curves Robotic Palletization
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Staff IC Packaging Engineer

Qualcomm

San Diego, CA 23 days ago $154,000–$231,000
Actively hiring Competitive pay
FCCSP FCBGA SiP/Modules RDL-based packages 2.5D/3D integration Design of Experiments Best Known Methods Process Control Plans DFM FMEA SPC/QC Reliability Testing Failure Analysis Flip Chip Wire Bond Substrate Technologies Wafer-Level Processes Laser Groove Technology Six Sigma
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Sr. Staff Packaging Engineer

Qualcomm

San Diego, CA 45 days ago $180,400–$270,600
Actively hiring Above market
FCBGA LGA FCCSP DOE ABF EMIB wafer bumping project management communication skills reliability standards test methods qualification procedures failure analysis techniques substrate manufacturing processes technical project management
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Staff Packaging Engineer

Qualcomm

San Diego, CA 156 days ago $154,000–$231,000
Actively hiring Competitive pay
Flip Chip Wire Bond System in Package (SiP) Design for Manufacturability (DFM) Failure Mode and Effects Analysis (FMEA) Laser Groove Technology Package Manufacturing Technical Project Management Reliability Test Methods Six Sigma
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