Senior Packaging Engineer
At a glance
AI generatedTL;DR
The IC Package Engineering team at Qualcomm seeks a senior reliability engineer to drive advanced packaging technologies for high-performance systems. This role involves defining and executing Design of Experiments (DOE) for package, board-level, and system-level reliability evaluations, performing PCB assembly and troubleshooting, analyzing experimental data using statistical methods like Weibull analysis, and developing new test methodologies. The ideal candidate will collaborate with cross-functional teams to provide actionable insights and recommendations, support lab operations, and interface with vendors for process improvements. Preferred qualifications include experience with semiconductor packaging, SMT/BLR processes, mechanical stress characterization, and hands-on use of reliability testing equipment such as thermal cycling chambers, drop shock test systems, Instron machines, and high-speed data acquisition systems. Knowledge of industry standards like JEDEC, IPC, ASTM, and AEC is also required.
Skills
What you'll do
- Define and execute Design of Experiments for package reliability evaluation.
- Analyze experimental results using statistical methods like Weibull analysis.
- Develop new test methodologies to evaluate emerging packaging technologies.
- Provide data-driven recommendations to support design and product decisions.
- Interface with vendors and suppliers for process improvements and equipment.
- Generate technical reports and presentations for internal and customer use.
- Perform PCB assembly, rework, and troubleshooting for test vehicles/products.
What we're looking for
- Bachelor's degree in relevant engineering field with at least 2 years of experience.
- Master's or PhD in relevant engineering field with minimum required work experience.
- Experience with semiconductor packaging and SMT/BLR processes.
- Hands-on expertise with reliability test equipment like Thermal Cycling Chambers, Drop shock testers, Instron machines.
- Knowledge of mechanical stress/strain characterization techniques and industry standards (JEDEC, IPC).
- Ability to define and execute Design of Experiments for package reliability evaluation.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 595 open roles on FindRole.
Listed pay typically runs $148,300–$222,500 across 540 roles with salary data.
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