Silicon Photonics & Optical Packaging Engineer

Apple Inc

Confirmed live yesterday High trust

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Work type: On-site
Location: Austin, TX
Posted: 2 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

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Similar $210k

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3499 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2707 roles with salary data.

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TL;DR · Silicon Photonics & Optical Packaging Engineer

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The Silicon Photonics & Optical Packaging Eng joins the hardware team to lead silicon photonics packaging technology development for next-generation optical interconnects. This role focuses on developing high-efficient optical I/O module architectures, assembly processes, and optical coupling designs for single-mode fiber packaging. You will design and model silicon photonic devices, simulate packaging architectures, and prototype integrated photonic packages while correlating simulations with optical and electrical measurements. Key responsibilities include defining package BOMs, managing micro-optical component assembly, and collaborating with vendors and foundries to move solutions from concept to high-volume manufacturing. Required skills include expertise in Lumerical, Zemax, or COMSOL, CMOS BEOL wafer scale processing, flip chip assembly, and experience with lasers, modulators, and photodetectors to solve performance, reliability, yield, and cost challenges.

Skills

Silicon Photonics Optical Packaging Lumerical Zemax COMSOL CMOS BEOL Flip Chip Assembly CoC CoW WLP Optical I/O Fiber Assembly Signal Integrity Passive Alignment MUX/DeMUX

What you'll do

Design and model silicon photonic devices and optical interconnects to optimize coupling, thermal, and signal integrity.
Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using specialized simulation tools.
Prototype and characterize integrated photonic packages by correlating simulation results with optical and electrical measurements.
Lead the development of silicon photonics engine module architectures and co-packaging solutions.
Establish optical coupling designs and manufacturing processes optimized for performance, reliability, yield, and cost.
Drive micro-optical component assembly and interface characterization through innovation work with vendors, foundries, and OSATs.
Define assembly baseline processes and determine the package bill of materials (BOM).
Document technical findings and results through reports and presentations to support next-generation optical I/O development.

What we're looking for

BS degree and 10+ years of relevant industry experience.
M.S. or Ph.D. in Physics (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering, or an equivalent field (preferred).
Minimum 5 years of work experience in the related field with an M.S. and/or Ph.D. (preferred).
Strong theoretical background in optics and photonics fundamentals and device/module integration (preferred).
Hands-on experience in packaging and measuring fiber-coupled devices (preferred).
Hands-on experience in optical component design, simulation, qualification, and fiber assembly using active and passive alignment tools (preferred).
Hands-on experience with CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, etc.) (preferred).
Experience with silicon photonics device lasers, modulators, PDs, and passive components like Si WG or MUX/DeMUX (preferred).

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