Silicon Photonics & Optical Packaging Engineer

What you'll do

• Design and model silicon photonic devices and optical interconnects to optimize coupling, thermal, and signal integrity.
• Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using specialized simulation tools.
• Prototype and characterize integrated photonic packages by correlating simulations with optical and electrical measurements.
• Lead the development of silicon photonics engine module architecture and co-packaging solutions.
• Establish optical coupling designs and manufacturing processes optimized for performance, reliability, yield, and cost.
• Drive micro-optical component assembly and interface characterization through innovation work with vendors, foundries, and OSATs.
• Define assembly baseline processes and determine the package bill of materials.

What we're looking for

• BS degree and 3+ years of relevant industry experience.
• M.S. or Ph.D. in Physics (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering, or an equivalent field (preferred).
• Minimum 5 years of work experience in the related field with an M.S. and/or Ph.D. (preferred).
• Strong theoretical background in optics and photonics fundamentals, device/module integration (preferred).
• Hands-on experience in packaging and measuring fiber-coupled devices (preferred).
• Hands-on experience in optical component design, simulation, qualification, and fiber assembly using active and passive alignment tools (preferred).
• Hands-on experience with CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, etc.) (preferred).
• Experience with silicon photonics device laser, modulator, PD, and passive components such as Si WG, MUX/DeMUX (preferred).