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Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
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The Silicon Photonics & Optical Packaging Eng joins the hardware team to lead silicon photonics packaging technology development and optical engine module efforts. This role involves designing, modeling, and simulating silicon photonic devices and interconnects while optimizing for coupling, thermal, and signal integrity performance. The engineer will develop packaging architectures that integrate photonic chips, fibers, and electronics, and manage the transition of solutions from concept to high-volume manufacturing through collaboration with foundries and OSAT partners. Key responsibilities include prototyping integrated packages, characterizing fiber-coupled devices, and defining assembly processes for single-mode fiber packaging. Required skills include proficiency in Lumerical, Zemax, or COMSOL tools, as well as experience with CMOS BEOL wafer scale processing, flip chip assembly, and components like lasers, modulators, and photodiodes to solve challenges in next-generation optical I/O connectivity.
Design and model silicon photonic devices and optical interconnects to optimize coupling, thermal, and signal integrity.
Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using specialized simulation tools.
Prototype and characterize integrated photonic packages by correlating simulations with physical optical and electrical measurements.
Lead the development of Si photonics engine modules, fiber array connectors, and co-packaging optics.
Manage the transition of silicon photonics packaging solutions from initial concept to high-volume manufacturing.
Coordinate with vendors, foundries, and OSAT partners to develop and manufacture scalable packaging solutions.
Define assembly baseline processes and select components for optimized performance, reliability, yield, and cost.
What we're looking for
Bachelor of Science degree and 10+ years of relevant industry experience.
Master's or Doctorate in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field (preferred).
Strong theoretical background in optics, photonics fundamentals, and device/module integration.
Experience with silicon photonics components such as lasers, modulators, photodetectors, and passive components like waveguides (preferred).
Hands-on experience in packaging and measuring fiber-coupled devices.
Hands-on experience in optical component design, simulation, qualification, and single or multi-mode fiber assembly using active and passive alignment tools.
Experience with CMOS BEOL wafer scale processing and flip chip assembly techniques like CoC, CoW, and WLP (preferred).
Excellent teamwork and communication skills (preferred).