Photonic Packaging Engineer

Cisco

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Carlsbad, CA
Salary
$136,500–$198,500 / yr
Employment
Full-time
Posted
25 days ago
Freshness
Confirmed live today
Closes
Dec 15, 2026

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $198k
This role $168k
$125k $241k
below market most similar roles pay here above market

This role pays less than 76% of similar roles. Most pay $168,200–$227,500 — the blue band above. At the midpoint, this role pays about $168k versus about $198k for comparable roles.

Based on 240 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 307 open roles on FindRole.

Listed pay typically runs $167,700–$245,000 across 224 roles with salary data.

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At a glance

TL;DR · Photonic Packaging Engineer

The Photonic Packaging Engineer joins the Silicon One team to develop next-generation packaging platforms, novel subassemblies, and electromechanical prototypes for Silicon Photonics Integrated Circuits and chipsets. This role involves engineering the foundation of high-speed optical connectivity by creating advanced packaging platforms and cutting-edge electromechanical assemblies. Key responsibilities include automating assembly systems, applying AI/ML and analytics to optimize high-volume manufacturing, and simulating edge cases to enhance diagnostic usability across the product lifecycle. The position requires expertise in hardware and process automation, machine vision, and data analysis using SQL and JMP. Candidates should possess software development skills in C# on .NET and knowledge of photonics, fiber optics, and semiconductor lasers. The work addresses complex physics and assembly challenges to enable high-speed optical connectivity for global networks.

What you'll do

  • Develop next-generation packaging platforms and novel subassemblies for Silicon Photonics Integrated Circuits.
  • Create electromechanical prototypes for high-speed optical connectivity and global network infrastructure.
  • Automate assembly systems to optimize high-volume manufacturing processes.
  • Apply AI/ML and analytics to simulate edge cases and enhance diagnostic usability.
  • Partner with global hardware, software, and manufacturing teams to drive project delivery.
  • Mentor engineers on the use of AI-assisted tools and automation technologies.

What we're looking for

  • Must have a Bachelor's degree plus 7 years of related experience.
  • Must have a Master's degree plus 4 years of related experience.
  • Must have a PhD plus 1 year of related experience.
  • Must have hardware or process automation experience.
  • Experience in hardware/software automation of photonics assembly/test (preferred).
  • Experience with machine vision in an automation environment (preferred).
  • Data analysis using SQL/JMP in a semiconductor production environment (preferred).
  • Software development using C# on .NET (preferred).
  • Knowledge of photonics, fiber optics, and semiconductor lasers (preferred).

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