Photonic Packaging Engineer

Cisco

Confirmed live 2 days ago High trust

Quick summary

Work type
On-site
Location
Carlsbad, CA
Salary
$136,500–$198,500 / yr
Posted
8 days ago
Freshness
Confirmed live 2 days ago
Closes
Oct 27, 2026
Nearby
20 roles within 25 mi

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $181k
This role $168k
$127k most similar roles pay here $228k

This role pays less than 62% of similar roles. Most pay $150,000–$212,718 — the shaded band above. At the midpoint, this role pays about $168k versus about $181k for comparable roles.

Based on 240 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 196 open roles on FindRole.

Listed pay typically runs $167,700–$245,200 across 196 roles with salary data.

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At a glance

TL;DR · Photonic Packaging Engineer

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As a Photonic Packaging Engineer within the Optics group, you will join the Common Hardware Group to develop next-generation packaging platforms, novel subassemblies, and electromechanical prototypes for Silicon Photonics Integrated Circuits and chipsets. You will be responsible for building advanced packaging platforms and crafting electromechanical assemblies that power high-speed optical connectivity. Your daily work involves automating assembly systems and applying AI/ML analytics to optimize high-volume manufacturing while simulating edge cases to enhance diagnostic usability throughout the product lifecycle. The role requires proficiency in hardware and process automation, machine vision in automated environments, and data analysis using SQL and JMP. You will also utilize C# on .NET for software development. This position addresses critical physics and assembly challenges within the domain of silicon photonics to support high-speed networking infrastructure and advanced optical connectivity solutions.

Skills

Silicon Photonics Machine Vision C# .NET SQL JMP AI ML Data Analysis Automation Fiber Optics Semiconductor Lasers High-Volume Manufacturing Software Development

What you'll do

  • Develop next-generation packaging platforms and novel subassemblies for Silicon Photonics integrated circuits.
  • Engineer electromechanical prototypes to support high-speed optical connectivity and global networks.
  • Automate assembly systems to optimize high-volume manufacturing processes.
  • Apply AI/ML analytics to simulate edge cases and improve diagnostic usability across the product lifecycle.
  • Solve complex physics and assembly challenges related to photonics and semiconductor lasers.
  • Mentor other engineers on the use of AI-assisted tools and advanced analytics.
  • Partner with global cross-functional teams to drive project delivery and international deployments.

What we're looking for

  • A Bachelor's degree with 7 years of related experience is required.
  • A Master's degree with 4 years of related experience is required.
  • A PhD with 1 year of related experience is required.
  • Experience in hardware or process automation is required.
  • Experience in the hardware/software automation of photonics assembly and testing is preferred.
  • Experience with machine vision in an automation environment is preferred.
  • Data analysis using SQL or JMP in a semiconductor production environment is preferred.
  • Software development using C# on .NET is preferred.

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