This role pays more than
78%
of similar roles. Most pay
$177,250–$236,425
— the shaded band above.
At the midpoint, this role pays about
$244k
versus about
$207k
for comparable roles.
Based on 240 similar postings.
Employer
About Apple Inc
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has
1984 open roles
on FindRole.
Listed pay typically runs
$175,000–$277,600
across 1590 roles with salary data.
Silicon Photonics EPM, Data Center SoC is an engineering leadership role within the silicon organization focused on data center SoCs. The manager drives the end-to-end development of high-speed Analog, Mixed-Signal (AMS), and Silicon Photonics IP programs, including SerDes, PLLs, Data Converters, TIAs, drivers, and optical I/O subsystems from concept through mass production. This role involves coordinating cross-functional teams across IC Design, Packaging, Reliability, and Legal to manage complex projects involving 2.5D/3D packaging, SiPh process platforms, and co-packaged optics. Key responsibilities include defining electrical and optical testing frameworks, managing multi-disciplinary supply chains including foundries and OSATs, and navigating the evolving landscape of high-bandwidth silicon interconnects. Required expertise includes advanced EDA tools, IP development methodologies, and experience with components like lasers, modulators, photodetectors, waveguides, and MUX/DeMUX for data center infrastructure.
Manage the end-to-end program lifecycle for Mixed-Signal IP and Silicon Photonics engines from concept through mass production.
Orchestrate the development of optical engine modules, fiber array integration, and co-packaged optics solutions.
Partner with foundries, OSATs, and component vendors to co-develop proprietary hardware solutions for data center products.
Define requirements and implementation strategies for advanced electrical and optical test structures and characterization.
Act as the central hub connecting cross-functional teams including IC Design, Packaging, Reliability, and Legal to meet technical gates.
Synchronize global engineering efforts and deliverables across multiple international time zones and a distributed photonics ecosystem.
Identify risks across a multi-disciplinary supply chain and develop mitigation strategies for high-priority hardware milestones.
What we're looking for
BS in Electrical Engineering, Electrical and Computer Engineering, Applied Physics, Optics, or a related field.
10+ years of relevant experience.
Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management.
MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials Science, or an equivalent field (preferred).
Hands-on program leadership experience with Silicon Photonics devices and subsystems or optical I/O and co-packaged optics for data center applications (preferred).
Extensive experience with AMS IPs supporting optical interconnects, including high-speed SerDes, TIAs, laser/modulator drivers, CDRs, and PLLs across advanced technology nodes (preferred).
Familiarity with optical packaging concepts such as fiber-array attach, active/passive alignment, flip-chip, and thermal/reliability considerations (preferred).
Experience with adjacent optical technologies like uLED or uVCSEL is a plus.