Signal Integrity Engineer, Memory Interface

Apple Inc

Confirmed live yesterday Low trust

Quick summary

Work type
On-site
Location
San Francisco, CA
Salary
$129,300–$225,300 / yr
Posted
143 days ago
Freshness
Confirmed live yesterday

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $189k
This role $177k
$118k most similar roles pay here $237k

This role pays more than 50% of similar roles. Most pay $161,965–$216,250 — the shaded band above. At the midpoint, this role pays about $177k versus about $189k for comparable roles.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Signal Integrity Engineer, Memory Interface

As a Signal Integrity Engineer – Memory Interface, you will join the team developing SoCs for mobile devices, focusing specifically on memory interface signal integrity from package to board. You will perform electrical and physical design of memory systems, including extraction and validation of packages and motherboards. Your daily work involves conducting end-to-end signal and power integrity simulation studies for die, interposer, and PCB components to meet strict timing and voltage specifications. You will collaborate with circuit, controller, product, and system engineering teams to optimize designs, provide floorplan guidelines, and improve product yield. Key technical requirements include expertise in 3D/2D EM simulation tools, transmission line theory, and Python programming. You will also utilize lab equipment such as VNA, TDR, real-time scopes, and spectrum analyzers to correlate simulations with silicon measurements for next-generation signaling schemes.

What you'll do

  • Conduct end-to-end signal and power integrity simulation studies for memory systems from die to PCB.
  • Model channels and power delivery networks to meet strict timing and voltage specifications.
  • Perform electrical extraction and validation of package and multi-layer board (MLB) designs.
  • Develop and execute test plans to validate signal and power integrity.
  • Correlate simulation results with actual silicon measurements.
  • Provide design guidelines and optimal IO settings to cross-functional teams.
  • Conduct feasibility studies for next-generation signaling schemes.
  • Debug and improve product yield in coordination with product and system engineering teams.

What we're looking for

  • A bachelor's degree is the minimum requirement.
  • An MSEE with 5 years of industry experience or a Ph.D. is preferred.
  • Experience with signal and power integrity issues of memory interfaces is preferred.
  • Experience in package/board design, PI/SI methodology development, and lab correlation is preferred.
  • Familiarity with lab equipment such as VNA, TDR, real-time scope, and spectrum analyzers is preferred.
  • Strong fundamentals in transmission line theory and 2D/3D EM simulation tools are required.
  • Proficiency in Python and experience using generative AI coding assistants to enhance productivity are required.

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